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UPD78P324LP(A1)-XXX

Description
UPD78P324LP(A1)-XXX
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size644KB,82 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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UPD78P324LP(A1)-XXX Overview

UPD78P324LP(A1)-XXX

UPD78P324LP(A1)-XXX Parametric

Parameter NameAttribute value
Brand NameRenesas
Reach Compliance Codeunknown
Base Number Matches1
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1
st
, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas
Electronics Corporation
took over all the business of both
companies.
Therefore, although the old company name remains in this document, it is a valid
Renesas
Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1
st
, 2010
Renesas Electronics Corporation
Issued by:
Renesas Electronics Corporation
(http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.

UPD78P324LP(A1)-XXX Related Products

UPD78P324LP(A1)-XXX UPD78P324GJ-5BJ UPD78P324KC UPD78P324GJ(A1)-XXX-5BJ UPD78P324LP(A2)
Description UPD78P324LP(A1)-XXX UPD78P324GJ-5BJ UPD78P324KC UPD78P324GJ(A1)-XXX-5BJ UPD78P324LP(A2)
Brand Name Renesas Renesas Renesas Renesas Renesas
Reach Compliance Code unknown unknown unknown unknown unknown
Base Number Matches 1 1 1 1 -
Parts packaging code - QFP QFN - QFJ
package instruction - QFP, QFP74,.9SQ,40 QCCN, LCC68,.95SQ - QCCN, LDCC68,1.0SQ
Contacts - 74 68 - 68
Has ADC - NO NO - NO
Address bus width - 16 16 - 16
bit size - 16 16 - 16
CPU series - UPD78K3 UPD78K3 - UPD78K3
maximum clock frequency - 16 MHz 16 MHz - 16 MHz
DAC channel - NO NO - NO
DMA channel - NO NO - NO
External data bus width - 8 8 - 8
JESD-30 code - S-PQFP-G74 S-CQCC-N68 - S-PQCC-N68
JESD-609 code - e0 e0 - e0
length - 20 mm 24.13 mm - 24.2 mm
Number of I/O lines - 39 39 - 39
Number of terminals - 74 68 - 68
Maximum operating temperature - 70 °C 70 °C - 70 °C
Minimum operating temperature - -10 °C -10 °C - -10 °C
PWM channel - NO NO - NO
Package body material - PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED - PLASTIC/EPOXY
encapsulated code - QFP QCCN - QCCN
Encapsulate equivalent code - QFP74,.9SQ,40 LCC68,.95SQ - LDCC68,1.0SQ
Package shape - SQUARE SQUARE - SQUARE
Package form - FLATPACK CHIP CARRIER - CHIP CARRIER
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
power supply - 5 V 5 V - 5 V
Certification status - Not Qualified Not Qualified - Not Qualified
RAM (bytes) - 768 768 - 768
rom(word) - 32768 32768 - 32768
ROM programmability - OTPROM EEPROM - OTPROM
Maximum seat height - 3.7 mm 3.5 mm - 4.6 mm
speed - 16 MHz 16 MHz - 16 MHz
Maximum slew rate - 95 mA 95 mA - 87 mA
Maximum supply voltage - 5.5 V 5.5 V - 5.5 V
Minimum supply voltage - 4.5 V 4.5 V - 4.5 V
Nominal supply voltage - 5 V 5 V - 5 V
surface mount - YES YES - YES
technology - CMOS CMOS - CMOS
Temperature level - COMMERCIAL COMMERCIAL - COMMERCIAL
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form - GULL WING NO LEAD - NO LEAD
Terminal pitch - 1 mm 1.27 mm - 1.27 mm
Terminal location - QUAD QUAD - QUAD
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
width - 20 mm 24.13 mm - 24.2 mm
uPs/uCs/peripheral integrated circuit type - MICROCONTROLLER MICROCONTROLLER - MICROCONTROLLER
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