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WE128K32-150G2TIA

Description
EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, CERAMIC, QFP-68
Categorystorage    storage   
File Size1MB,16 Pages
ManufacturerMercury Systems Inc
Download Datasheet Parametric View All

WE128K32-150G2TIA Overview

EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, CERAMIC, QFP-68

WE128K32-150G2TIA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMercury Systems Inc
package instructionQFP,
Reach Compliance Codecompliant
ECCN code3A991.B.1.B.1
Maximum access time150 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CQFP-G68
length22.36 mm
memory density4194304 bit
Memory IC TypeEEPROM MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height4.57 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width22.36 mm
Maximum write cycle time (tWC)10 ms
Base Number Matches1
WE128K32-XXX
128Kx32 EEPROM MODULE, SMD 5962-94585
FEATURES

Access Times of 125, 140, 150, 200, 250, 300ns

Packaging:
• 66-pin, PGA Type, 27.3mm (1.075") square, Hermetic
Ceramic HIP (Package 400)
• 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180") high,
(Package 509)

Organized as 128Kx32; User Configurable as 256Kx16 or
512Kx8

Write Endurance 10,000 Cycles

Data Retention Ten Years Minimum (at +25°C)

Commercial, Industrial and Military Temperature Ranges

Low Power CMOS

Automatic Page Write Operation

Page Write Cycle Time: 10ms Max
*This product is subject to change without notice.

Data Polling for End of Write Detection

Hardware and Software Data Protection

TTL Compatible Inputs and Outputs

5 Volt Power Supply

Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation

Weight
WE128K32-XG2TX – 8 grams typical
WE128K32-XH1X – 13 grams typical
FIGURE 1 – PIN CONFIGURATION FOR WE128K32N-XH1X
TOP VIEW
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
3
A
4
A
5
WE
3
#
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
OE#
A
0-16
128K x 8
W E
1
# CS
1
#
PIN DESCRIPTION
56
I/O0-31
A0-16
WE1-4#
CS1-4#
OE#
V
CC
GND
NC
Data Input/Output
Address Inputs
Write Enable
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
W E
2
# CS
2
#
W E
3
# CS
3
#
W E
4
# CS
4
#
128K x 8
128K x 8
128K x 8
8
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2012
Rev. 15
© 2012 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
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