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HB52D168GB-B6BL

Description
128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM
Categorystorage    storage   
File Size126KB,19 Pages
ManufacturerELPIDA
Websitehttp://www.elpida.com/en
Download Datasheet Parametric Compare View All

HB52D168GB-B6BL Overview

128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM

HB52D168GB-B6BL Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerELPIDA
Parts packaging codeDIMM
package instructionDIMM, DIMM144,32
Contacts144
Reach Compliance Codeunknown
ECCN codeEAR99
access modeSINGLE BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N144
memory density1073741824 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width64
Humidity sensitivity level1
Number of functions1
Number of ports1
Number of terminals144
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature65 °C
Minimum operating temperature
organize16MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM144,32
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)225
power supply3.3 V
Certification statusNot Qualified
refresh cycle8192
self refreshYES
Maximum standby current0.008 A
Maximum slew rate0.88 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
HB52F168GB-B
HB52D168GB-B
EO
Description
Features
128 MB Unbuffered SDRAM Micro DIMM
16-Mword
×
64-bit, 133/100 MHz Memory Bus, 1-Bank Module
(4 pcs of 16 M
×
16 components)
PC133/100 SDRAM
The HB52F168GB and HB52D168GB are a 16M
×
64
×
1 banks Synchronous Dynamic RAM Micro Dual
In-line Memory Module (Micro DIMM), mounted 4 pieces of 256-Mbit SDRAM (HM5225165BTT) sealed
in TSOP package and 1 piece of serial EEPROM (2-kbit EEPROM) for Presence Detect (PD). An outline of
the products is 144-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, they make high
density mounting possible without surface mount technology. They provide common data inputs and outputs.
Decoupling capacitors are mounted beside TSOP on the module board.
144-pin Zig Zag Dual tabs socket type (dual lead out)
Outline: 38.00 mm (Length)
×
30.00 mm (Height)
×
3.80 mm (Thickness)
Lead pitch: 0.50 mm
3.3 V power supply
Clock frequency: 133/100 MHz (max)
LVTTL interface
Data bus width:
×
64 Non parity
Single pulsed
RAS
4 Banks can operates simultaneously and independently
Burst read/write operation and burst read/single write operation capability
Programmable burst length: 1/2/4/8
2 variations of burst sequence
Sequential
Interleave
Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd.
L
Pr
E0008H10 (1st edition)
(Previous ADE-203-1219A (Z))
Jan. 19, 2001
od
uc
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HB52D168GB-B6BL Related Products

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Description 128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM 128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM 128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM 128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM 128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM
Is it Rohs certified? incompatible - incompatible incompatible -
Maker ELPIDA - ELPIDA ELPIDA -
Parts packaging code DIMM - DIMM DIMM -
package instruction DIMM, DIMM144,32 - DIMM, DIMM144,32 DIMM, DIMM144,32 -
Contacts 144 - 144 144 -
Reach Compliance Code unknown - unknow unknow -
ECCN code EAR99 - EAR99 EAR99 -
access mode SINGLE BANK PAGE BURST - SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST -
Maximum access time 6 ns - 5.4 ns 5.4 ns -
Other features AUTO/SELF REFRESH - AUTO/SELF REFRESH AUTO/SELF REFRESH -
Maximum clock frequency (fCLK) 100 MHz - 133 MHz 133 MHz -
I/O type COMMON - COMMON COMMON -
JESD-30 code R-XDMA-N144 - R-XDMA-N144 R-XDMA-N144 -
memory density 1073741824 bit - 1073741824 bi 1073741824 bi -
Memory IC Type SYNCHRONOUS DRAM MODULE - SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE -
memory width 64 - 64 64 -
Humidity sensitivity level 1 - 1 1 -
Number of functions 1 - 1 1 -
Number of ports 1 - 1 1 -
Number of terminals 144 - 144 144 -
word count 16777216 words - 16777216 words 16777216 words -
character code 16000000 - 16000000 16000000 -
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS -
Maximum operating temperature 65 °C - 65 °C 65 °C -
organize 16MX64 - 16MX64 16MX64 -
Output characteristics 3-STATE - 3-STATE 3-STATE -
Package body material UNSPECIFIED - UNSPECIFIED UNSPECIFIED -
encapsulated code DIMM - DIMM DIMM -
Encapsulate equivalent code DIMM144,32 - DIMM144,32 DIMM144,32 -
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR -
Package form MICROELECTRONIC ASSEMBLY - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY -
Peak Reflow Temperature (Celsius) 225 - 225 225 -
power supply 3.3 V - 3.3 V 3.3 V -
Certification status Not Qualified - Not Qualified Not Qualified -
refresh cycle 8192 - 8192 8192 -
self refresh YES - YES YES -
Maximum standby current 0.008 A - 0.008 A 0.008 A -
Maximum slew rate 0.88 mA - 0.88 mA 0.88 mA -
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V -
Minimum supply voltage (Vsup) 3 V - 3 V 3 V -
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V -
surface mount NO - NO NO -
technology CMOS - CMOS CMOS -
Temperature level COMMERCIAL - COMMERCIAL COMMERCIAL -
Terminal form NO LEAD - NO LEAD NO LEAD -
Terminal pitch 0.8 mm - 0.8 mm 0.8 mm -
Terminal location DUAL - DUAL DUAL -
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED -
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