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HB52D168GB-B

Description
128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM
File Size126KB,19 Pages
ManufacturerELPIDA
Websitehttp://www.elpida.com/en
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HB52D168GB-B Overview

128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM

HB52F168GB-B
HB52D168GB-B
EO
Description
Features
128 MB Unbuffered SDRAM Micro DIMM
16-Mword
×
64-bit, 133/100 MHz Memory Bus, 1-Bank Module
(4 pcs of 16 M
×
16 components)
PC133/100 SDRAM
The HB52F168GB and HB52D168GB are a 16M
×
64
×
1 banks Synchronous Dynamic RAM Micro Dual
In-line Memory Module (Micro DIMM), mounted 4 pieces of 256-Mbit SDRAM (HM5225165BTT) sealed
in TSOP package and 1 piece of serial EEPROM (2-kbit EEPROM) for Presence Detect (PD). An outline of
the products is 144-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, they make high
density mounting possible without surface mount technology. They provide common data inputs and outputs.
Decoupling capacitors are mounted beside TSOP on the module board.
144-pin Zig Zag Dual tabs socket type (dual lead out)
Outline: 38.00 mm (Length)
×
30.00 mm (Height)
×
3.80 mm (Thickness)
Lead pitch: 0.50 mm
3.3 V power supply
Clock frequency: 133/100 MHz (max)
LVTTL interface
Data bus width:
×
64 Non parity
Single pulsed
RAS
4 Banks can operates simultaneously and independently
Burst read/write operation and burst read/single write operation capability
Programmable burst length: 1/2/4/8
2 variations of burst sequence
Sequential
Interleave
Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd.
L
Pr
E0008H10 (1st edition)
(Previous ADE-203-1219A (Z))
Jan. 19, 2001
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Description 128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM 128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM 128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM 128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM 128 MB Unbuffered SDRAM Micro DIMM 16-Mword 】 64-bit, 133/100 MHz Memory Bus, 1-Bank Module (4 pcs of 16 M 】 16 components) PC133/100 SDRAM
Is it Rohs certified? - - incompatible incompatible incompatible
Maker - - ELPIDA ELPIDA ELPIDA
Parts packaging code - - DIMM DIMM DIMM
package instruction - - DIMM, DIMM144,32 DIMM, DIMM144,32 DIMM, DIMM144,32
Contacts - - 144 144 144
Reach Compliance Code - - unknow unknow unknown
ECCN code - - EAR99 EAR99 EAR99
access mode - - SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST
Maximum access time - - 5.4 ns 5.4 ns 6 ns
Other features - - AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) - - 133 MHz 133 MHz 100 MHz
I/O type - - COMMON COMMON COMMON
JESD-30 code - - R-XDMA-N144 R-XDMA-N144 R-XDMA-N144
memory density - - 1073741824 bi 1073741824 bi 1073741824 bit
Memory IC Type - - SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width - - 64 64 64
Humidity sensitivity level - - 1 1 1
Number of functions - - 1 1 1
Number of ports - - 1 1 1
Number of terminals - - 144 144 144
word count - - 16777216 words 16777216 words 16777216 words
character code - - 16000000 16000000 16000000
Operating mode - - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature - - 65 °C 65 °C 65 °C
organize - - 16MX64 16MX64 16MX64
Output characteristics - - 3-STATE 3-STATE 3-STATE
Package body material - - UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code - - DIMM DIMM DIMM
Encapsulate equivalent code - - DIMM144,32 DIMM144,32 DIMM144,32
Package shape - - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) - - 225 225 225
power supply - - 3.3 V 3.3 V 3.3 V
Certification status - - Not Qualified Not Qualified Not Qualified
refresh cycle - - 8192 8192 8192
self refresh - - YES YES YES
Maximum standby current - - 0.008 A 0.008 A 0.008 A
Maximum slew rate - - 0.88 mA 0.88 mA 0.88 mA
Maximum supply voltage (Vsup) - - 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - - 3 V 3 V 3 V
Nominal supply voltage (Vsup) - - 3.3 V 3.3 V 3.3 V
surface mount - - NO NO NO
technology - - CMOS CMOS CMOS
Temperature level - - COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form - - NO LEAD NO LEAD NO LEAD
Terminal pitch - - 0.8 mm 0.8 mm 0.8 mm
Terminal location - - DUAL DUAL DUAL
Maximum time at peak reflow temperature - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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