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74HC7404

Description
5-Bit x 64-word FIFO register; 3-state
File Size127KB,28 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
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74HC7404 Overview

5-Bit x 64-word FIFO register; 3-state

INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
74HC/HCT7404
5-Bit x 64-word FIFO register;
3-state
Product specification
Supersedes data of October 1990
File under Integrated Circuits, IC06
September 1993

74HC7404 Related Products

74HC7404 74HC7404D 74HC7404N 74HCT7404 74HCT7404D 74HCT7404N
Description 5-Bit x 64-word FIFO register; 3-state 5-Bit x 64-word FIFO register; 3-state 5-Bit x 64-word FIFO register; 3-state 5-Bit x 64-word FIFO register; 3-state 5-Bit x 64-word FIFO register; 3-state 5-Bit x 64-word FIFO register; 3-state
Is it Rohs certified? - incompatible incompatible - incompatible incompatible
Maker - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction - SOP, SOP20,.4 DIP, DIP18,.3 - SOP, SOP20,.4 DIP, DIP18,.3
Reach Compliance Code - unknow unknow - unknow unknow
Maximum access time - 98 ns 98 ns - 108 ns 108 ns
Maximum clock frequency (fCLK) - 12 MHz 12 MHz - 12 MHz 12 MHz
JESD-30 code - R-PDSO-G20 R-PDIP-T18 - R-PDSO-G20 R-PDIP-T18
JESD-609 code - e0 e0 - e0 e0
Memory IC Type - OTHER FIFO OTHER FIFO - OTHER FIFO OTHER FIFO
memory width - 5 5 - 5 5
Number of terminals - 20 18 - 20 18
word count - 64 words 64 words - 64 words 64 words
character code - 64 64 - 64 64
Operating mode - ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature - 125 °C 125 °C - 125 °C 125 °C
organize - 64X5 64X5 - 64X5 64X5
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SOP DIP - SOP DIP
Encapsulate equivalent code - SOP20,.4 DIP18,.3 - SOP20,.4 DIP18,.3
Package shape - RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE IN-LINE - SMALL OUTLINE IN-LINE
power supply - 2/6 V 2/6 V - 5 V 5 V
Certification status - Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum slew rate - 0.001 mA 0.001 mA - 0.001 mA 0.001 mA
surface mount - YES NO - YES NO
technology - CMOS CMOS - CMOS CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE OTHER
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - GULL WING THROUGH-HOLE - GULL WING THROUGH-HOLE
Terminal pitch - 1.27 mm 2.54 mm - 1.27 mm 2.54 mm
Terminal location - DUAL DUAL - DUAL DUAL
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