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ISD5116

Description
Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
File Size674KB,57 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
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ISD5116 Overview

Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability

ISD5116
Advance Information
Single-Chip Voice Record/Playback Device Up to
16-Minute Duration with Digital Storage Capability
Features Summary
Fully-Integrated Solution
!
Single-chip voice record/playback solution
!
Dual storage of digital and analog information
Low Power Consumption
!
+2.7 to +3.3V (V
CC
) Supply Voltage
!
Supports 2.0V and 3.0V interface logic
!
Operating Current:
"
I
CC Play
= 15 mA (typical)
"
I
CC Rec
= 30 mA (typical)
"
I
CC Feedthrough
= 12 mA (typical)
!
Standby Current:
"
I
SB
= 1µA (typical)
!
Most stages can be individually powered down
to minimize power consumption
Enhanced Voice Features
!
One or two-way conversation record
!
One or two-way message playback
!
Voice memo record and playback
!
Private call screening
!
In-terminal answering machine
!
Personalized outgoing message
!
Private call announce while on call
Digital Memory Features
!
Up to 4 MB available
!
Storage of phone numbers, system configuration
parameters and message address table in cellular
application
Easy-to-use and Control
!
No compression algorithm development required
!
User-controllable sampling rates
!
Programmable analog interface
2
!
Fast mode I C serial interface (400 kHz)
!
Fully addressable to handle multiple messages
High Quality Solution
!
High quality voice and music reproduction
!
ISD’s standard 100-year message retention
(typical)
!
100K record cycles (typical) for analog data
!
10K record cycles (typical) for digital data
Options
!
Available in die form,
µBGA
(available upon
request), TSOP and SOIC
!
Extended (-20 to +70C) and Industrial (-40 to
+85C) available
ISD5116
ISD5116
28-PIN TSOP
SOIC
October 2000
Page 1

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ISD5116 ISD5116E ISD5116ED ISD5116EI ISD5116P ISD5116S ISD5116SD ISD5116SI ISD5116X
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Is it Rohs certified? - incompatible - incompatible incompatible incompatible - incompatible incompatible
Maker - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code - TSOP TSOP TSOP DIP SOIC SOIC SOIC DIE
package instruction - 8 X 13.40 MM, PLASTIC, TSOP1-28 TSOP1, 8 X 13.40 MM, PLASTIC, TSOP1-28 0.600 INCH, PLASTIC, DIP-28 0.300 INCH, PLASTIC, SOIC-28 SOP, 0.300 INCH, PLASTIC, SOIC-28 DIE,
Contacts - 28 28 28 28 28 28 28 27
Reach Compliance Code - _compli unknow _compli _compli _compli unknow not_compliant unknow
application - HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES ANSWERING MACHINE
Commercial integrated circuit types - SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 code - R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-XUUC-N27
JESD-609 code - e0 e4 e0 e0 e0 - e0 e0
length - 11.8 mm 11.8 mm 11.8 mm 36.83 mm 17.9 mm 17.9 mm 17.9 mm -
Number of functions - 1 1 1 1 1 1 1 1
Number of terminals - 28 28 28 28 28 28 28 27
Maximum operating temperature - 70 °C - 85 °C 70 °C 70 °C - 85 °C 50 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code - TSOP1 TSOP1 TSOP1 DIP SOP SOP SOP DIE
Encapsulate equivalent code - TSSOP28,.53,22 - TSSOP28,.53,22 DIP28,.6 SOP28,.4 - SOP28,.4 -
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE UNCASED CHIP
Peak Reflow Temperature (Celsius) - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
power supply - 3 V - 3 V 3 V 3 V - 3 V -
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum read time - 960 s 960 s 960 s 960 s 960 s 960 s 960 s 960 s
Maximum seat height - 1.2 mm 1.2 mm 1.2 mm 4.83 mm 2.65 mm 2.65 mm 2.65 mm -
Maximum slew rate - 40 mA - 40 mA 40 mA 40 mA - 40 mA -
Maximum supply voltage (Vsup) - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Minimum supply voltage (Vsup) - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
surface mount - YES YES YES NO YES YES YES YES
technology - CMOS - CMOS CMOS CMOS - CMOS -
Temperature level - COMMERCIAL - INDUSTRIAL COMMERCIAL COMMERCIAL - INDUSTRIAL COMMERCIAL
Terminal surface - Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) TIN LEAD
Terminal form - GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING NO LEAD
Terminal pitch - 0.55 mm 0.55 mm 0.55 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm -
Terminal location - DUAL DUAL DUAL DUAL DUAL DUAL DUAL UPPER
Maximum time at peak reflow temperature - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width - 8 mm 8 mm 8 mm 15.24 mm 7.5 mm 7.5 mm 7.5 mm -

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