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ISD5116SI

Description
Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size674KB,57 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

ISD5116SI Overview

Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability

ISD5116SI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWinbond Electronics Corporation
Parts packaging codeSOIC
package instruction0.300 INCH, PLASTIC, SOIC-28
Contacts28
Reach Compliance Codenot_compliant
applicationHAND-HELD DEVICES
Commercial integrated circuit typesSPEECH SYNTHESIZER WITH RCDG
JESD-30 codeR-PDSO-G28
JESD-609 codee0
length17.9 mm
Number of functions1
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3 V
Certification statusNot Qualified
Maximum read time960 s
Maximum seat height2.65 mm
Maximum slew rate40 mA
Maximum supply voltage (Vsup)3.3 V
Minimum supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.5 mm
Base Number Matches1
ISD5116
Advance Information
Single-Chip Voice Record/Playback Device Up to
16-Minute Duration with Digital Storage Capability
Features Summary
Fully-Integrated Solution
!
Single-chip voice record/playback solution
!
Dual storage of digital and analog information
Low Power Consumption
!
+2.7 to +3.3V (V
CC
) Supply Voltage
!
Supports 2.0V and 3.0V interface logic
!
Operating Current:
"
I
CC Play
= 15 mA (typical)
"
I
CC Rec
= 30 mA (typical)
"
I
CC Feedthrough
= 12 mA (typical)
!
Standby Current:
"
I
SB
= 1µA (typical)
!
Most stages can be individually powered down
to minimize power consumption
Enhanced Voice Features
!
One or two-way conversation record
!
One or two-way message playback
!
Voice memo record and playback
!
Private call screening
!
In-terminal answering machine
!
Personalized outgoing message
!
Private call announce while on call
Digital Memory Features
!
Up to 4 MB available
!
Storage of phone numbers, system configuration
parameters and message address table in cellular
application
Easy-to-use and Control
!
No compression algorithm development required
!
User-controllable sampling rates
!
Programmable analog interface
2
!
Fast mode I C serial interface (400 kHz)
!
Fully addressable to handle multiple messages
High Quality Solution
!
High quality voice and music reproduction
!
ISD’s standard 100-year message retention
(typical)
!
100K record cycles (typical) for analog data
!
10K record cycles (typical) for digital data
Options
!
Available in die form,
µBGA
(available upon
request), TSOP and SOIC
!
Extended (-20 to +70C) and Industrial (-40 to
+85C) available
ISD5116
ISD5116
28-PIN TSOP
SOIC
October 2000
Page 1

ISD5116SI Related Products

ISD5116SI ISD5116 ISD5116E ISD5116ED ISD5116EI ISD5116P ISD5116S ISD5116SD ISD5116X
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Is it Rohs certified? incompatible - incompatible - incompatible incompatible incompatible - incompatible
Maker Winbond Electronics Corporation - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code SOIC - TSOP TSOP TSOP DIP SOIC SOIC DIE
package instruction 0.300 INCH, PLASTIC, SOIC-28 - 8 X 13.40 MM, PLASTIC, TSOP1-28 TSOP1, 8 X 13.40 MM, PLASTIC, TSOP1-28 0.600 INCH, PLASTIC, DIP-28 0.300 INCH, PLASTIC, SOIC-28 SOP, DIE,
Contacts 28 - 28 28 28 28 28 28 27
Reach Compliance Code not_compliant - _compli unknow _compli _compli _compli unknow unknow
application HAND-HELD DEVICES - HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES ANSWERING MACHINE
Commercial integrated circuit types SPEECH SYNTHESIZER WITH RCDG - SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 code R-PDSO-G28 - R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28 R-XUUC-N27
JESD-609 code e0 - e0 e4 e0 e0 e0 - e0
length 17.9 mm - 11.8 mm 11.8 mm 11.8 mm 36.83 mm 17.9 mm 17.9 mm -
Number of functions 1 - 1 1 1 1 1 1 1
Number of terminals 28 - 28 28 28 28 28 28 27
Maximum operating temperature 85 °C - 70 °C - 85 °C 70 °C 70 °C - 50 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code SOP - TSOP1 TSOP1 TSOP1 DIP SOP SOP DIE
Encapsulate equivalent code SOP28,.4 - TSSOP28,.53,22 - TSSOP28,.53,22 DIP28,.6 SOP28,.4 - -
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE SMALL OUTLINE UNCASED CHIP
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
power supply 3 V - 3 V - 3 V 3 V 3 V - -
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum read time 960 s - 960 s 960 s 960 s 960 s 960 s 960 s 960 s
Maximum seat height 2.65 mm - 1.2 mm 1.2 mm 1.2 mm 4.83 mm 2.65 mm 2.65 mm -
Maximum slew rate 40 mA - 40 mA - 40 mA 40 mA 40 mA - -
Maximum supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Minimum supply voltage (Vsup) 2.7 V - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
surface mount YES - YES YES YES NO YES YES YES
technology CMOS - CMOS - CMOS CMOS CMOS - -
Temperature level INDUSTRIAL - COMMERCIAL - INDUSTRIAL COMMERCIAL COMMERCIAL - COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - TIN LEAD
Terminal form GULL WING - GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING NO LEAD
Terminal pitch 1.27 mm - 0.55 mm 0.55 mm 0.55 mm 2.54 mm 1.27 mm 1.27 mm -
Terminal location DUAL - DUAL DUAL DUAL DUAL DUAL DUAL UPPER
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
width 7.5 mm - 8 mm 8 mm 8 mm 15.24 mm 7.5 mm 7.5 mm -
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