EEWORLDEEWORLDEEWORLD

Part Number

Search

ISD5116EI

Description
Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size674KB,57 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

ISD5116EI Overview

Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability

ISD5116EI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWinbond Electronics Corporation
Parts packaging codeTSOP
package instruction8 X 13.40 MM, PLASTIC, TSOP1-28
Contacts28
Reach Compliance Code_compli
applicationHAND-HELD DEVICES
Commercial integrated circuit typesSPEECH SYNTHESIZER WITH RCDG
JESD-30 codeR-PDSO-G28
JESD-609 codee0
length11.8 mm
Number of functions1
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP28,.53,22
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3 V
Certification statusNot Qualified
Maximum read time960 s
Maximum seat height1.2 mm
Maximum slew rate40 mA
Maximum supply voltage (Vsup)3.3 V
Minimum supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.55 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
ISD5116
Advance Information
Single-Chip Voice Record/Playback Device Up to
16-Minute Duration with Digital Storage Capability
Features Summary
Fully-Integrated Solution
!
Single-chip voice record/playback solution
!
Dual storage of digital and analog information
Low Power Consumption
!
+2.7 to +3.3V (V
CC
) Supply Voltage
!
Supports 2.0V and 3.0V interface logic
!
Operating Current:
"
I
CC Play
= 15 mA (typical)
"
I
CC Rec
= 30 mA (typical)
"
I
CC Feedthrough
= 12 mA (typical)
!
Standby Current:
"
I
SB
= 1µA (typical)
!
Most stages can be individually powered down
to minimize power consumption
Enhanced Voice Features
!
One or two-way conversation record
!
One or two-way message playback
!
Voice memo record and playback
!
Private call screening
!
In-terminal answering machine
!
Personalized outgoing message
!
Private call announce while on call
Digital Memory Features
!
Up to 4 MB available
!
Storage of phone numbers, system configuration
parameters and message address table in cellular
application
Easy-to-use and Control
!
No compression algorithm development required
!
User-controllable sampling rates
!
Programmable analog interface
2
!
Fast mode I C serial interface (400 kHz)
!
Fully addressable to handle multiple messages
High Quality Solution
!
High quality voice and music reproduction
!
ISD’s standard 100-year message retention
(typical)
!
100K record cycles (typical) for analog data
!
10K record cycles (typical) for digital data
Options
!
Available in die form,
µBGA
(available upon
request), TSOP and SOIC
!
Extended (-20 to +70C) and Industrial (-40 to
+85C) available
ISD5116
ISD5116
28-PIN TSOP
SOIC
October 2000
Page 1

ISD5116EI Related Products

ISD5116EI ISD5116 ISD5116E ISD5116ED ISD5116P ISD5116S ISD5116SD ISD5116SI ISD5116X
Description Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
Is it Rohs certified? incompatible - incompatible - incompatible incompatible - incompatible incompatible
Maker Winbond Electronics Corporation - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code TSOP - TSOP TSOP DIP SOIC SOIC SOIC DIE
package instruction 8 X 13.40 MM, PLASTIC, TSOP1-28 - 8 X 13.40 MM, PLASTIC, TSOP1-28 TSOP1, 0.600 INCH, PLASTIC, DIP-28 0.300 INCH, PLASTIC, SOIC-28 SOP, 0.300 INCH, PLASTIC, SOIC-28 DIE,
Contacts 28 - 28 28 28 28 28 28 27
Reach Compliance Code _compli - _compli unknow _compli _compli unknow not_compliant unknow
application HAND-HELD DEVICES - HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES ANSWERING MACHINE
Commercial integrated circuit types SPEECH SYNTHESIZER WITH RCDG - SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 code R-PDSO-G28 - R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-XUUC-N27
JESD-609 code e0 - e0 e4 e0 e0 - e0 e0
length 11.8 mm - 11.8 mm 11.8 mm 36.83 mm 17.9 mm 17.9 mm 17.9 mm -
Number of functions 1 - 1 1 1 1 1 1 1
Number of terminals 28 - 28 28 28 28 28 28 27
Maximum operating temperature 85 °C - 70 °C - 70 °C 70 °C - 85 °C 50 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code TSOP1 - TSOP1 TSOP1 DIP SOP SOP SOP DIE
Encapsulate equivalent code TSSOP28,.53,22 - TSSOP28,.53,22 - DIP28,.6 SOP28,.4 - SOP28,.4 -
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE - SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE UNCASED CHIP
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
power supply 3 V - 3 V - 3 V 3 V - 3 V -
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum read time 960 s - 960 s 960 s 960 s 960 s 960 s 960 s 960 s
Maximum seat height 1.2 mm - 1.2 mm 1.2 mm 4.83 mm 2.65 mm 2.65 mm 2.65 mm -
Maximum slew rate 40 mA - 40 mA - 40 mA 40 mA - 40 mA -
Maximum supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Minimum supply voltage (Vsup) 2.7 V - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
surface mount YES - YES YES NO YES YES YES YES
technology CMOS - CMOS - CMOS CMOS - CMOS -
Temperature level INDUSTRIAL - COMMERCIAL - COMMERCIAL COMMERCIAL - INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) TIN LEAD
Terminal form GULL WING - GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING NO LEAD
Terminal pitch 0.55 mm - 0.55 mm 0.55 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm -
Terminal location DUAL - DUAL DUAL DUAL DUAL DUAL DUAL UPPER
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 8 mm - 8 mm 8 mm 15.24 mm 7.5 mm 7.5 mm 7.5 mm -
PADS file conversion AD file problem
I would like to ask: In which version of Altium Designer can the ASC file (Pads layout V 9.3 file) exported by PADS9.3 be imported? AD 9 cannot....
sh820 PCB Design
I want to ask about the development environment of the self-service terminals in the mobile business hall.
It is a device placed in the business hall like an ATM machine, which can be used for phone bill inquiry, bill printing, self-service payment, and service activation. It has a touch screen. It should ...
20977977 Embedded System
Seeking a solution for preamplification
When designing an amplifier, we need to design an input impedance buffer circuit greater than 1M. How should we design it? We usually use 50Ω. We applied for opa693. Can this chip do it? Please help m...
sunshine_chen Electronics Design Contest
485 Communication Processing
Previously, 232 was used for communication between PC and 51 single-chip microcomputer. When testing the communication protocol, everything was normal. The multiple data could be judged and the return...
淮海的大学 51mcu
Is it so difficult to post a message?
If it doesn’t work, just kill it. Are you still allowed to play? Can you play properly? ??? ???...
郝见你 Talking

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1256  418  986  1383  836  26  9  20  28  17 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号