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ISD5116X

Description
Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size674KB,57 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

ISD5116X Overview

Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability

ISD5116X Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerWinbond Electronics Corporation
Parts packaging codeDIE
package instructionDIE,
Contacts27
Reach Compliance Codeunknow
applicationANSWERING MACHINE
Commercial integrated circuit typesSPEECH SYNTHESIZER WITH RCDG
JESD-30 codeR-XUUC-N27
JESD-609 codee0
Number of functions1
Number of terminals27
On-chip memory typeFLASH
Maximum operating temperature50 °C
Minimum operating temperature
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeRECTANGULAR
Package formUNCASED CHIP
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum read time960 s
Maximum supply voltage (Vsup)3.3 V
Minimum supply voltage (Vsup)2.7 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
ISD5116
Advance Information
Single-Chip Voice Record/Playback Device Up to
16-Minute Duration with Digital Storage Capability
Features Summary
Fully-Integrated Solution
!
Single-chip voice record/playback solution
!
Dual storage of digital and analog information
Low Power Consumption
!
+2.7 to +3.3V (V
CC
) Supply Voltage
!
Supports 2.0V and 3.0V interface logic
!
Operating Current:
"
I
CC Play
= 15 mA (typical)
"
I
CC Rec
= 30 mA (typical)
"
I
CC Feedthrough
= 12 mA (typical)
!
Standby Current:
"
I
SB
= 1µA (typical)
!
Most stages can be individually powered down
to minimize power consumption
Enhanced Voice Features
!
One or two-way conversation record
!
One or two-way message playback
!
Voice memo record and playback
!
Private call screening
!
In-terminal answering machine
!
Personalized outgoing message
!
Private call announce while on call
Digital Memory Features
!
Up to 4 MB available
!
Storage of phone numbers, system configuration
parameters and message address table in cellular
application
Easy-to-use and Control
!
No compression algorithm development required
!
User-controllable sampling rates
!
Programmable analog interface
2
!
Fast mode I C serial interface (400 kHz)
!
Fully addressable to handle multiple messages
High Quality Solution
!
High quality voice and music reproduction
!
ISD’s standard 100-year message retention
(typical)
!
100K record cycles (typical) for analog data
!
10K record cycles (typical) for digital data
Options
!
Available in die form,
µBGA
(available upon
request), TSOP and SOIC
!
Extended (-20 to +70C) and Industrial (-40 to
+85C) available
ISD5116
ISD5116
28-PIN TSOP
SOIC
October 2000
Page 1

ISD5116X Related Products

ISD5116X ISD5116 ISD5116E ISD5116ED ISD5116EI ISD5116P ISD5116S ISD5116SD ISD5116SI
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Is it Rohs certified? incompatible - incompatible - incompatible incompatible incompatible - incompatible
Maker Winbond Electronics Corporation - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code DIE - TSOP TSOP TSOP DIP SOIC SOIC SOIC
package instruction DIE, - 8 X 13.40 MM, PLASTIC, TSOP1-28 TSOP1, 8 X 13.40 MM, PLASTIC, TSOP1-28 0.600 INCH, PLASTIC, DIP-28 0.300 INCH, PLASTIC, SOIC-28 SOP, 0.300 INCH, PLASTIC, SOIC-28
Contacts 27 - 28 28 28 28 28 28 28
Reach Compliance Code unknow - _compli unknow _compli _compli _compli unknow not_compliant
application ANSWERING MACHINE - HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES HAND-HELD DEVICES
Commercial integrated circuit types SPEECH SYNTHESIZER WITH RCDG - SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 code R-XUUC-N27 - R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28
JESD-609 code e0 - e0 e4 e0 e0 e0 - e0
Number of functions 1 - 1 1 1 1 1 1 1
Number of terminals 27 - 28 28 28 28 28 28 28
Maximum operating temperature 50 °C - 70 °C - 85 °C 70 °C 70 °C - 85 °C
Package body material UNSPECIFIED - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIE - TSOP1 TSOP1 TSOP1 DIP SOP SOP SOP
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form UNCASED CHIP - SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum read time 960 s - 960 s 960 s 960 s 960 s 960 s 960 s 960 s
Maximum supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Minimum supply voltage (Vsup) 2.7 V - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
surface mount YES - YES YES YES NO YES YES YES
Temperature level COMMERCIAL - COMMERCIAL - INDUSTRIAL COMMERCIAL COMMERCIAL - INDUSTRIAL
Terminal surface TIN LEAD - Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form NO LEAD - GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING
Terminal location UPPER - DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
length - - 11.8 mm 11.8 mm 11.8 mm 36.83 mm 17.9 mm 17.9 mm 17.9 mm
Encapsulate equivalent code - - TSSOP28,.53,22 - TSSOP28,.53,22 DIP28,.6 SOP28,.4 - SOP28,.4
power supply - - 3 V - 3 V 3 V 3 V - 3 V
Maximum seat height - - 1.2 mm 1.2 mm 1.2 mm 4.83 mm 2.65 mm 2.65 mm 2.65 mm
Maximum slew rate - - 40 mA - 40 mA 40 mA 40 mA - 40 mA
technology - - CMOS - CMOS CMOS CMOS - CMOS
Terminal pitch - - 0.55 mm 0.55 mm 0.55 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm
width - - 8 mm 8 mm 8 mm 15.24 mm 7.5 mm 7.5 mm 7.5 mm

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