P83C750EFD datasheet, PDF - EEWORLD Datasheet

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P83C750EFD: DescriptionMicrocontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PDSO24; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，16 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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P83C750EFD Overview

Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PDSO24

P83C750EFD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	SSOP, SSOP24,.3
Reach Compliance Code	unknown
bit size	8
CPU series	8051
JESD-30 code	R-PDSO-G24
JESD-609 code	e0
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Encapsulate equivalent code	SSOP24,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	64
rom(word)	1024
ROM programmability	MROM
speed	16 MHz
Maximum slew rate	22 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	DUAL

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P83C750EFD Related Products

	P83C750EFD	P87C750EFD	P87C750PFD	P83C750PFD
Description	Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PDSO24	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDSO24	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 40MHz, CMOS, PDSO24	Microcontroller, 8-Bit, MROM, 8051 CPU, 40MHz, CMOS, PDSO24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	SSOP, SSOP24,.3	SSOP, SSOP24,.3	SSOP, SSOP24,.3	SSOP, SSOP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
bit size	8	8	8	8
CPU series	8051	8051	8051	8051
JESD-30 code	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24
JESD-609 code	e0	e0	e0	e0
Number of terminals	24	24	24	24
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	SSOP	SSOP	SSOP
Encapsulate equivalent code	SSOP24,.3	SSOP24,.3	SSOP24,.3	SSOP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	64	64	64	64
rom(word)	1024	1024	1024	1024
ROM programmability	MROM	UVPROM	UVPROM	MROM
speed	16 MHz	16 MHz	40 MHz	40 MHz
Maximum slew rate	22 mA	22 mA	55 mA	55 mA
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.635 mm	0.635 mm	0.635 mm	0.635 mm
Terminal location	DUAL	DUAL	DUAL	DUAL

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