Lead Temperature (Soldering, 5 sec.) ....................... 260°C
Operating Ratings
(2)
Supply Input Voltage (V
IN
) ............................ +2.5V to +12V
Enable Input Voltage (V
EN
) ...................................0V to V
IN
Junction Temperature (T
J
) ........................ –40°C to +125°C
Package Thermal Resistance........................... see Table 1
Electrical Characteristics
(3)
V
IN
= V
OUT
+ 1.0V; C
OUT
= 4.7µF, I
OUT
= 100µA; T
J
= 25°C,
bold
values indicate –40°C ≤ T
J
≤ +125°C; unless noted.
Symbol
V
OUT
ΔV
OUT
/ΔT
ppm/°C
ΔV
OUT
/V
OUT
ΔV
OUT
/V
OUT
V
IN
– V
OUT
Parameter
Conditions
Min
–1
–2
40
Output Voltage Accuracy
Output Voltage
Temperature Coefficient
Line Regulation
Load Regulation
Dropout Voltage
(6)
V
IN
= V
OUT
+ 1V to 12V
I
OUT
= 100µA to 500mA,
Note 5
I
OUT
= 100µA
I
OUT
= 50mA
I
OUT
= 150mA
I
OUT
= 500mA
I
GND
Ground Pin Current
(7, 8)
V
EN
≥ 3.0V, I
OUT
= 100µA
V
EN
≥ 3.0V, I
OUT
= 50mA
V
EN
≥ 3.0V, I
OUT
= 150mA
V
EN
≥ 3.0V, I
OUT
= 500mA
Ground Pin Quiescent Current
(8)
PSRR
I
LIMIT
e
no
ΔV
OUT
/ΔP
D
nV/ Hz
nV/ Hz
Typical
Max
1
2
Units
%
%
variation from nominal V
OUT
Note 4
0.009
0.05
10
115
175
350
80
350
1.8
12
0.05
0.10
75
700
0.05
500
300
0.05
0.1
0.5
0.7
60
80
175
250
300
400
500
600
130
170
650
900
2.5
3.0
20
25
3
8
1000
%/V
%
mV
mV
mV
mV
µA
µA
mA
mA
µA
µA
dB
mA
%/W
V
EN
≤ 0.4V
f = 120Hz
Note 9
Ripple Rejection
Current Limit
Thermal Regulation
Output Noise
(10)
V
EN
≤ 0.18V
V
OUT
= 0V
I
OUT
= 50mA, C
OUT
= 2.2µF, C
BYP
= 0
I
OUT
= 50mA, C
OUT
= 2.2µF, C
BYP
= 470pF
ENABLE Input
V
ENL
Enable Input Logic-Low Voltage
V
EN
= logic low (regulator shutdown)
V
EN
= logic high (regulator enabled)
V
ENL
≤ 0.18V
2.0
0.01
0.01
2
5
–1
–2
20
25
30
50
0.4
0.18
V
V
µA
µA
µA
µA
µA
µA
I
ENL
I
ENH
Enable Input Current
V
ENL
≤ 0.4V
V
ENH
= 2.0V
V
ENH
= 12V
M0371-121003
4
January 2005
MIC5219
Notes:
Micrel
1. Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating
the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, T
J
(max),
the junction-to-ambient thermal resistance,
θ
JA
, and the ambient temperature, T
A
. The maximum allowable power dissipation at any ambient
temperature is calculated using: P
D
(max) = (T
J
(max) – T
A
)
÷ θ
JA
. Exceeding the maximum allowable power dissipation will result in excessive die
temperature, and the regulator will go into thermal shutdown. See Table 1 and the “Thermal Considerations” section for details.
2. The device is not guaranteed to function outside its operating rating.
3. Specification for packaged product only.
4. Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.
5. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range
from 100µA to 500mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
6. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differen-
tial.
7. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load
current plus the ground pin current.
8. V
EN
is the voltage externally applied to devices with the EN (enable) input pin.
9. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regu-
lation effects. Specifications are for a 500mA load pulse at V
IN
= 12V for t = 10ms.
10. C
BYP
is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust) pin.
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