|
IDT7MB6040S20K |
IDT7MB6040S12K |
IDT7MB6040S16K |
IDT7MB6040S25K |
| Description |
Cache SRAM Module, 32KX64, 30ns, CMOS |
Cache SRAM Module, 32KX64, 45ns, CMOS |
Cache SRAM Module, 32KX64, 35ns, CMOS |
Cache SRAM Module, 32KX64, 24ns, CMOS |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
| Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
| ECCN code |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
| Maximum access time |
30 ns |
45 ns |
35 ns |
24 ns |
| Maximum clock frequency (fCLK) |
20 MHz |
12 MHz |
16.7 MHz |
25 MHz |
| I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
| JESD-30 code |
R-XQMA-P128 |
R-XQMA-P128 |
R-XQMA-P128 |
R-XQMA-P128 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| memory density |
2097152 bit |
2097152 bit |
2097152 bit |
2097152 bit |
| Memory IC Type |
CACHE SRAM MODULE |
CACHE SRAM MODULE |
CACHE SRAM MODULE |
CACHE SRAM MODULE |
| memory width |
64 |
64 |
64 |
64 |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of terminals |
128 |
128 |
128 |
128 |
| word count |
32768 words |
32768 words |
32768 words |
32768 words |
| character code |
32000 |
32000 |
32000 |
32000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
| organize |
32KX64 |
32KX64 |
32KX64 |
32KX64 |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
| encapsulated code |
QIP |
QIP |
QIP |
QIP |
| Encapsulate equivalent code |
QI128,2.1/2.3,100 |
QI128,2.1/2.3,100 |
QI128,2.1/2.3,100 |
QI128,2.1/2.3,100 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
| Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum slew rate |
4.05 mA |
3.75 mA |
3.75 mA |
4.5 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
NO |
NO |
NO |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
| Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
| Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |