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IRLR8726PBF_09

Description
86 A, 30 V, 0.058 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA
Categorysemiconductor    Discrete semiconductor   
File Size355KB,11 Pages
ManufacturerInternational Rectifier ( Infineon )
Websitehttp://www.irf.com/
Download Datasheet Parametric Compare View All

IRLR8726PBF_09 Overview

86 A, 30 V, 0.058 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA

IRLR8726PBF_09 Parametric

Parameter NameAttribute value
Number of terminals2
Minimum breakdown voltage30 V
Processing package descriptionROHS COMPLIANT, DPAK, 3 PIN
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
terminal coatingMATTE TIN OVER NICKEL
Terminal locationSINGLE
Packaging MaterialsPLASTIC/EPOXY
structureSINGLE WITH BUILT-IN DIODE
Shell connectionDRAIN
Number of components1
transistor applicationsSWITCHING
Transistor component materialsSILICON
Channel typeN-CHANNEL
field effect transistor technologyMETAL-OXIDE SEMICONDUCTOR
operating modeENHANCEMENT
Transistor typeGENERAL PURPOSE POWER
Maximum leakage current86 A
Rated avalanche energy120 mJ
Maximum drain on-resistance0.0580 ohm
Maximum leakage current pulse340 A
PD - 97146A
IRLR8726PbF
IRLU8726PbF
HEXFET
®
Power MOSFET
Applications
l
High Frequency Synchronous Buck
V
DSS
R
DS(on)
max
Qg (typ.)
Converters for Computer Processor Power
30V 5.8m @V
GS
= 10V 15nC
l
High Frequency Isolated DC-DC
Converters with Synchronous Rectification
D
D
for Telecom and Industrial Use
:
Benefits
l
Very Low R
DS(on)
at 4.5V V
GS
l
Ultra-Low Gate Impedance
l
Fully Characterized Avalanche Voltage
and Current
l
Lead-Free
l
RoHS compliant
G
D
S
G
D
S
D-Pak
IRLR8726PbF
G
D
I-Pak
IRLU8726PbF
S
Gate
Drain
Max.
30
± 20
86
Source
Units
V
Absolute Maximum Ratings
Parameter
V
DS
V
GS
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
P
D
@T
C
= 100°C
T
J
T
STG
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
h
Maximum Power Dissipation
h
Maximum Power Dissipation
Linear Derating Factor
Operating Junction and
Storage Temperature Range
™
f
61
f
340
75
38
A
W
W/°C
°C
0.5
-55 to + 175
300 (1.6mm from case)
Soldering Temperature, for 10 seconds
Thermal Resistance
Parameter
R
θJC
R
θJA
R
θJA
Junction-to-Case
h
Typ.
Max.
2.0
50
110
Units
°C/W
Junction-to-Ambient (PCB Mount)
Junction-to-Ambient
h
ghÃ
–––
–––
–––
Notes

through
†
are on page 11
ORDERING INFORMATION:
See detailed ordering and shipping information on the last page of this data sheet.
www.irf.com
1
11/23/09

IRLR8726PBF_09 Related Products

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Description 86 A, 30 V, 0.058 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA 86 A, 30 V, 0.058 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA 86 A, 30 V, 0.058 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-251AA 86 A, 30 V, 0.058 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252AA
Number of terminals 2 2 3 2
surface mount Yes YES NO YES
Terminal form GULL WING GULL WING THROUGH-HOLE GULL WING
Terminal location SINGLE SINGLE SINGLE SINGLE
Shell connection DRAIN DRAIN DRAIN DRAIN
Number of components 1 1 1 1
transistor applications SWITCHING SWITCHING SWITCHING SWITCHING
Transistor component materials SILICON SILICON SILICON SILICON
Is it lead-free? - Lead free Lead free Lead free
Is it Rohs certified? - conform to conform to conform to
Maker - International Rectifier ( Infineon ) International Rectifier ( Infineon ) International Rectifier ( Infineon )
Parts packaging code - TO-252AA TO-251AA TO-252AA
package instruction - SMALL OUTLINE, R-PSSO-G2 ROHS COMPLIANT, IPAK-3 SMALL OUTLINE, R-PSSO-G2
Contacts - 3 3 3
Reach Compliance Code - compliant not_compliant compliant
ECCN code - EAR99 EAR99 EAR99
Avalanche Energy Efficiency Rating (Eas) - 120 mJ 120 mJ 120 mJ
Configuration - SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage - 30 V 30 V 30 V
Maximum drain current (Abs) (ID) - 86 A 86 A 86 A
Maximum drain current (ID) - 86 A 86 A 86 A
Maximum drain-source on-resistance - 0.058 Ω 0.058 Ω 0.058 Ω
FET technology - METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 code - TO-252AA TO-251AA TO-252AA
JESD-30 code - R-PSSO-G2 R-PSIP-T3 R-PSSO-G2
JESD-609 code - e3 e3 e3
Humidity sensitivity level - 1 1 1
Operating mode - ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature - 175 °C 175 °C 175 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) - 260 260 260
Polarity/channel type - N-CHANNEL N-CHANNEL N-CHANNEL
Maximum power dissipation(Abs) - 75 W 75 W 75 W
Maximum pulsed drain current (IDM) - 340 A 340 A 340 A
Certification status - Not Qualified Not Qualified Not Qualified
Terminal surface - MATTE TIN OVER NICKEL Matte Tin (Sn) - with Nickel (Ni) barrier MATTE TIN OVER NICKEL
Maximum time at peak reflow temperature - 30 30 30

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