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74AUP2G32GM

Description
Low-power dual 2-input OR gate
Categorylogic    logic   
File Size78KB,17 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74AUP2G32GM Overview

Low-power dual 2-input OR gate

74AUP2G32GM Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFN
package instruction1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
Contacts8
Reach Compliance Codecompli
seriesAUP/ULP/V
JESD-30 codeS-PQCC-N8
length1.6 mm
Load capacitance (CL)30 pF
Logic integrated circuit typeOR GATE
MaximumI(ol)0.0017 A
Humidity sensitivity level1
Number of functions2
Number of entries2
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVQCCN
Encapsulate equivalent codeLCC8,.06SQ,20
Package shapeSQUARE
Package formCHIP CARRIER, VERY THIN PROFILE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply1.2/3.3 V
Prop。Delay @ Nom-Su23.7 ns
propagation delay (tpd)23.7 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.1 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width1.6 mm
74AUP2G32
Low-power dual 2-input OR gate
Rev. 03 — 8 January 2009
Product data sheet
1. General description
The 74AUP2G32 provides the dual 2-input OR function.
Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
. The I
OFF
circuitry disables the output, preventing a damaging backflow current through the device
when it is powered down.
2. Features
I
Wide supply voltage range from 0.8 V to 3.6 V
I
High noise immunity
I
Complies with JEDEC standards:
N
JESD8-12 (0.8 V to 1.3 V)
N
JESD8-11 (0.9 V to 1.65 V)
N
JESD8-7 (1.2 V to 1.95 V)
N
JESD8-5 (1.8 V to 2.7 V)
N
JESD8-B (2.7 V to 3.6 V)
I
ESD protection:
N
HBM JESD22-A114E Class 3A exceeds 5 000 V
N
MM JESD22-A115-A exceeds 200 V
N
CDM JESD22-C101C exceeds 1000 V
I
Low static power consumption; I
CC
= 0.9
µA
(maximum)
I
Latch-up performance exceeds 100 mA per JESD 78 Class II
I
Inputs accept voltages up to 3.6 V
I
Low noise overshoot and undershoot < 10 % of V
CC
I
I
OFF
circuitry provides partial Power-down mode operation
I
Multiple package options
I
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C

74AUP2G32GM Related Products

74AUP2G32GM 74AUP2G32DC 74AUP2G32 74AUP2G32GD 74AUP2G32GT
Description Low-power dual 2-input OR gate Low-power dual 2-input OR gate Low-power dual 2-input OR gate Low-power dual 2-input OR gate Low-power dual 2-input OR gate
Is it Rohs certified? conform to conform to - conform to conform to
Maker NXP NXP - NXP NXP
Parts packaging code QFN TSSOP - SON SON
package instruction 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 - 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, SON-8 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, SON-8
Contacts 8 8 - 8 8
Reach Compliance Code compli compli - compli compli
series AUP/ULP/V AUP/ULP/V - AUP/ULP/V AUP/ULP/V
JESD-30 code S-PQCC-N8 R-PDSO-G8 - R-PDSO-N8 R-PDSO-N8
length 1.6 mm 2.3 mm - 3 mm 1.95 mm
Load capacitance (CL) 30 pF 30 pF - 30 pF 30 pF
Logic integrated circuit type OR GATE OR GATE - OR GATE OR GATE
MaximumI(ol) 0.0017 A 0.0017 A - 0.0017 A 0.0017 A
Humidity sensitivity level 1 1 - 1 1
Number of functions 2 2 - 2 2
Number of entries 2 2 - 2 2
Number of terminals 8 8 - 8 8
Maximum operating temperature 125 °C 125 °C - 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VQCCN VSSOP - VSON VSON
Encapsulate equivalent code LCC8,.06SQ,20 TSSOP8,.12,20 - SOLCC8,.11,20 SOLCC8,.04,20
Package shape SQUARE RECTANGULAR - RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
method of packing TAPE AND REEL TAPE AND REEL - TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 - 260 260
power supply 1.2/3.3 V 1.2/3.3 V - 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Su 23.7 ns 23.7 ns - 23.7 ns 23.7 ns
propagation delay (tpd) 23.7 ns 23.7 ns - 23.7 ns 23.7 ns
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified
Schmitt trigger NO NO - NO NO
Maximum seat height 0.5 mm 1 mm - 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V - 3.6 V 3.6 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V - 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.1 V 1.1 V - 1.1 V 1.1 V
surface mount YES YES - YES YES
technology CMOS CMOS - CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal form NO LEAD GULL WING - NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.5 mm - 0.5 mm 0.5 mm
Terminal location QUAD DUAL - DUAL DUAL
Maximum time at peak reflow temperature 30 30 - 30 30
width 1.6 mm 2 mm - 2 mm 1 mm

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