74HC3G34DC datasheet, PDF - EEWORLD Datasheet

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74HC3G34DC: DescriptionTriple buffer gate; Categorylogic logic; File Size68KB，13 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74HC3G34DC Overview

Triple buffer gate

74HC3G34DC Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	TSSOP
package instruction	2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
Contacts	8
Reach Compliance Code	compliant
series	HC/UH
JESD-30 code	R-PDSO-G8
JESD-609 code	e4
length	2.3 mm
Logic integrated circuit type	BUFFER
Humidity sensitivity level	1
Number of functions	3
Number of entries	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
propagation delay (tpd)	125 ns
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	2 mm
Base Number Matches	1

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74HC3G34; 74HCT3G34

Triple buffer gate

Rev. 05 — 7 May 2009

Product data sheet

1. General description

The 74HC3G34; 74HCT3G34 are high-speed Si-gate CMOS devices. They provide three

buffer gates.

The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.

The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.

2. Features

Wide supply voltage range from 2.0 V to 6.0 V

Symmetrical output impedance

High noise immunity

Low-power dissipation

Balanced propagation delays

Multiple package options

ESD protection:

HBM JESD22-A114E exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

Speciﬁed from

−40 °C

to +85

°C

and

−40 °C

to +125

°C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range Name

74HC3G34DP

74HCT3G34DP

74HC3G34DC

74HCT3G34DC

74HC3G34GD

74HCT3G34GD

−40 °C

to +125

°C

XSON8U

−40 °C

to +125

°C

VSSOP8

−40 °C

to +125

°C

TSSOP8

Description

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

Version

SOT505-2

Type number

plastic very thin shrink small outline package; 8 leads; SOT765-1

body width 2.3 mm

plastic extremely thin small outline package; no leads; SOT996-2

8 terminals; UTLP based; body 3

0.5 mm

74HC3G34DC Related Products

	74HC3G34DC	74HC3G34	74HC3G34DP	74HC3G34GD	74HCT3G34	74HCT3G34GD	74HCT3G34DC	74HCT3G34DP
Description	Triple buffer gate	Triple buffer gate	Triple buffer gate	Triple buffer gate	Triple buffer gate	Triple buffer gate	Triple buffer gate	Triple buffer gate
Is it Rohs certified?	conform to	-	conform to	conform to	-	conform to	conform to	conform to
Maker	NXP	-	NXP	NXP	-	NXP	NXP	NXP
Parts packaging code	TSSOP	-	SOIC	SON	-	SON	TSSOP	SOIC
package instruction	2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8	-	3 MM, 0.50 MM PITCH, PLASTIC, SOT505-2, TSSOP-8	3 X 2 MM, 0.5 MM HEIGHT, SOT996-2, SON-8	-	3 X 2 MM, 0.5 MM HEIGHT, SOT996-2, SON-8	VSSOP,	3 MM, 0.50 MM PITCH, PLASTIC, SOT505-2, TSSOP-8
Contacts	8	-	8	8	-	8	8	8
Reach Compliance Code	compliant	-	compliant	compli	-	compli	compliant	compli
series	HC/UH	-	HC/UH	HC/UH	-	HCT	HCT	HCT
JESD-30 code	R-PDSO-G8	-	S-PDSO-G8	R-PDSO-N8	-	R-PDSO-N8	R-PDSO-G8	S-PDSO-G8
length	2.3 mm	-	3 mm	3 mm	-	3 mm	2.3 mm	3 mm
Logic integrated circuit type	BUFFER	-	BUFFER	BUFFER	-	BUFFER	BUFFER	BUFFER
Humidity sensitivity level	1	-	1	1	-	1	1	1
Number of functions	3	-	3	3	-	3	3	3
Number of entries	1	-	1	1	-	1	1	1
Number of terminals	8	-	8	8	-	8	8	8
Maximum operating temperature	125 °C	-	125 °C	125 °C	-	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VSSOP	-	TSSOP	VSON	-	VSON	VSSOP	TSSOP
Package shape	RECTANGULAR	-	SQUARE	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	SQUARE
Package form	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	-	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	-	260	260	-	260	260	260
propagation delay (tpd)	125 ns	-	125 ns	125 ns	-	29 ns	29 ns	29 ns
Certification status	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1 mm	-	1.1 mm	0.5 mm	-	0.5 mm	1 mm	1.1 mm
Maximum supply voltage (Vsup)	6 V	-	6 V	6 V	-	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2 V	-	2 V	2 V	-	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	-	5 V	5 V	-	5 V	5 V	5 V
surface mount	YES	-	YES	YES	-	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	-	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	GULL WING	-	GULL WING	NO LEAD	-	NO LEAD	GULL WING	GULL WING
Terminal pitch	0.5 mm	-	0.65 mm	0.5 mm	-	0.5 mm	0.5 mm	0.65 mm
Terminal location	DUAL	-	DUAL	DUAL	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	-	30	30	-	30	30	30
width	2 mm	-	3 mm	2 mm	-	2 mm	2 mm	3 mm
Base Number Matches	1	-	1	1	-	1	1	1

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