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74HC3G34DP

Description
Triple buffer gate
Categorylogic    logic   
File Size68KB,13 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HC3G34DP Overview

Triple buffer gate

74HC3G34DP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSOIC
package instruction3 MM, 0.50 MM PITCH, PLASTIC, SOT505-2, TSSOP-8
Contacts8
Reach Compliance Codecompliant
seriesHC/UH
JESD-30 codeS-PDSO-G8
JESD-609 codee4
length3 mm
Logic integrated circuit typeBUFFER
Humidity sensitivity level1
Number of functions3
Number of entries1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)125 ns
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3 mm
Base Number Matches1
74HC3G34; 74HCT3G34
Triple buffer gate
Rev. 05 — 7 May 2009
Product data sheet
1. General description
The 74HC3G34; 74HCT3G34 are high-speed Si-gate CMOS devices. They provide three
buffer gates.
The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.
The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
2. Features
I
I
I
I
I
I
I
Wide supply voltage range from 2.0 V to 6.0 V
Symmetrical output impedance
High noise immunity
Low-power dissipation
Balanced propagation delays
Multiple package options
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
I
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74HC3G34DP
74HCT3G34DP
74HC3G34DC
74HCT3G34DC
74HC3G34GD
74HCT3G34GD
−40 °C
to +125
°C
XSON8U
−40 °C
to +125
°C
VSSOP8
−40 °C
to +125
°C
TSSOP8
Description
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
Version
SOT505-2
Type number
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; UTLP based; body 3
×
2
×
0.5 mm

74HC3G34DP Related Products

74HC3G34DP 74HC3G34 74HC3G34DC 74HC3G34GD 74HCT3G34 74HCT3G34GD 74HCT3G34DC 74HCT3G34DP
Description Triple buffer gate Triple buffer gate Triple buffer gate Triple buffer gate Triple buffer gate Triple buffer gate Triple buffer gate Triple buffer gate
Is it Rohs certified? conform to - conform to conform to - conform to conform to conform to
Maker NXP - NXP NXP - NXP NXP NXP
Parts packaging code SOIC - TSSOP SON - SON TSSOP SOIC
package instruction 3 MM, 0.50 MM PITCH, PLASTIC, SOT505-2, TSSOP-8 - 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 3 X 2 MM, 0.5 MM HEIGHT, SOT996-2, SON-8 - 3 X 2 MM, 0.5 MM HEIGHT, SOT996-2, SON-8 VSSOP, 3 MM, 0.50 MM PITCH, PLASTIC, SOT505-2, TSSOP-8
Contacts 8 - 8 8 - 8 8 8
Reach Compliance Code compliant - compliant compli - compli compliant compli
series HC/UH - HC/UH HC/UH - HCT HCT HCT
JESD-30 code S-PDSO-G8 - R-PDSO-G8 R-PDSO-N8 - R-PDSO-N8 R-PDSO-G8 S-PDSO-G8
length 3 mm - 2.3 mm 3 mm - 3 mm 2.3 mm 3 mm
Logic integrated circuit type BUFFER - BUFFER BUFFER - BUFFER BUFFER BUFFER
Humidity sensitivity level 1 - 1 1 - 1 1 1
Number of functions 3 - 3 3 - 3 3 3
Number of entries 1 - 1 1 - 1 1 1
Number of terminals 8 - 8 8 - 8 8 8
Maximum operating temperature 125 °C - 125 °C 125 °C - 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C - -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP - VSSOP VSON - VSON VSSOP TSSOP
Package shape SQUARE - RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR SQUARE
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 - 260 260 - 260 260 260
propagation delay (tpd) 125 ns - 125 ns 125 ns - 29 ns 29 ns 29 ns
Certification status Not Qualified - Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 1.1 mm - 1 mm 0.5 mm - 0.5 mm 1 mm 1.1 mm
Maximum supply voltage (Vsup) 6 V - 6 V 6 V - 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2 V - 2 V 2 V - 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V - 5 V 5 V - 5 V 5 V 5 V
surface mount YES - YES YES - YES YES YES
technology CMOS - CMOS CMOS - CMOS CMOS CMOS
Temperature level AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form GULL WING - GULL WING NO LEAD - NO LEAD GULL WING GULL WING
Terminal pitch 0.65 mm - 0.5 mm 0.5 mm - 0.5 mm 0.5 mm 0.65 mm
Terminal location DUAL - DUAL DUAL - DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 - 30 30 - 30 30 30
width 3 mm - 2 mm 2 mm - 2 mm 2 mm 3 mm
Base Number Matches 1 - 1 1 - 1 1 1
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