EEWORLDEEWORLDEEWORLD

Part Number

Search

74HCT3G34DC

Description
Triple buffer gate
Categorylogic    logic   
File Size68KB,13 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HCT3G34DC Overview

Triple buffer gate

74HCT3G34DC Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP
package instructionVSSOP,
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
seriesHCT
JESD-30 codeR-PDSO-G8
JESD-609 codee4
length2.3 mm
Logic integrated circuit typeBUFFER
Humidity sensitivity level1
Number of functions3
Number of entries1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)29 ns
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width2 mm
Base Number Matches1
74HC3G34; 74HCT3G34
Triple buffer gate
Rev. 05 — 7 May 2009
Product data sheet
1. General description
The 74HC3G34; 74HCT3G34 are high-speed Si-gate CMOS devices. They provide three
buffer gates.
The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.
The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
2. Features
I
I
I
I
I
I
I
Wide supply voltage range from 2.0 V to 6.0 V
Symmetrical output impedance
High noise immunity
Low-power dissipation
Balanced propagation delays
Multiple package options
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
I
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74HC3G34DP
74HCT3G34DP
74HC3G34DC
74HCT3G34DC
74HC3G34GD
74HCT3G34GD
−40 °C
to +125
°C
XSON8U
−40 °C
to +125
°C
VSSOP8
−40 °C
to +125
°C
TSSOP8
Description
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
Version
SOT505-2
Type number
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; UTLP based; body 3
×
2
×
0.5 mm

74HCT3G34DC Related Products

74HCT3G34DC 74HC3G34 74HC3G34DC 74HC3G34DP 74HC3G34GD 74HCT3G34 74HCT3G34GD 74HCT3G34DP
Description Triple buffer gate Triple buffer gate Triple buffer gate Triple buffer gate Triple buffer gate Triple buffer gate Triple buffer gate Triple buffer gate
Is it Rohs certified? conform to - conform to conform to conform to - conform to conform to
Maker NXP - NXP NXP NXP - NXP NXP
Parts packaging code TSSOP - TSSOP SOIC SON - SON SOIC
package instruction VSSOP, - 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 3 MM, 0.50 MM PITCH, PLASTIC, SOT505-2, TSSOP-8 3 X 2 MM, 0.5 MM HEIGHT, SOT996-2, SON-8 - 3 X 2 MM, 0.5 MM HEIGHT, SOT996-2, SON-8 3 MM, 0.50 MM PITCH, PLASTIC, SOT505-2, TSSOP-8
Contacts 8 - 8 8 8 - 8 8
Reach Compliance Code compliant - compliant compliant compli - compli compli
series HCT - HC/UH HC/UH HC/UH - HCT HCT
JESD-30 code R-PDSO-G8 - R-PDSO-G8 S-PDSO-G8 R-PDSO-N8 - R-PDSO-N8 S-PDSO-G8
length 2.3 mm - 2.3 mm 3 mm 3 mm - 3 mm 3 mm
Logic integrated circuit type BUFFER - BUFFER BUFFER BUFFER - BUFFER BUFFER
Humidity sensitivity level 1 - 1 1 1 - 1 1
Number of functions 3 - 3 3 3 - 3 3
Number of entries 1 - 1 1 1 - 1 1
Number of terminals 8 - 8 8 8 - 8 8
Maximum operating temperature 125 °C - 125 °C 125 °C 125 °C - 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VSSOP - VSSOP TSSOP VSON - VSON TSSOP
Package shape RECTANGULAR - RECTANGULAR SQUARE RECTANGULAR - RECTANGULAR SQUARE
Package form SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 - 260 260 260 - 260 260
propagation delay (tpd) 29 ns - 125 ns 125 ns 125 ns - 29 ns 29 ns
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 1 mm - 1 mm 1.1 mm 0.5 mm - 0.5 mm 1.1 mm
Maximum supply voltage (Vsup) 5.5 V - 6 V 6 V 6 V - 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V - 2 V 2 V 2 V - 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V - 5 V 5 V 5 V - 5 V 5 V
surface mount YES - YES YES YES - YES YES
technology CMOS - CMOS CMOS CMOS - CMOS CMOS
Temperature level AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal form GULL WING - GULL WING GULL WING NO LEAD - NO LEAD GULL WING
Terminal pitch 0.5 mm - 0.5 mm 0.65 mm 0.5 mm - 0.5 mm 0.65 mm
Terminal location DUAL - DUAL DUAL DUAL - DUAL DUAL
Maximum time at peak reflow temperature 30 - 30 30 30 - 30 30
width 2 mm - 2 mm 3 mm 2 mm - 2 mm 3 mm
Base Number Matches 1 - 1 1 1 - 1 1
[Me and Yatli] + A story about to begin
[i=s]This post was last edited by jinglixixi on 2020-8-27 11:22[/i]From relevant resources, we know that Arteli is a technology company established in Chongqing Hi-tech Zone in June 2016. Although "go...
jinglixixi Domestic Chip Exchange
Obtaining the Hongmeng source code for BearPi HM Nano (be careful of pitfalls)
Did you have a good time during the May Day holiday? The May Day holiday happened to be Mazu's birthday, so it was a grand celebration in my hometown. I went home to pray to Mazu for her blessing. By ...
邦bang Embedded System
DXP software interface issues
I'd like to ask you, I used to be able to open the PCB library that comes with DXP and see all the detailed package data in it, but suddenly I can't open it anymore, and I found that there is a piece ...
我的眼里只有PCB PCB Design
After adding the ie component, the following problems occurred. Please help me analyze it.
Hello everyone, I added IE components in VS2005, and the program compiled and burned without any problems. But the program cannot start normally. I connected the serial port and printed information. A...
xushangjin Embedded System
STM8 weak question, continue to ask (about PWM signal)
I am lazy, mainly because I often feel dizzy after reading the datasheet for a short time. I think it is convenient to ask everyone on the forum, and I feel more confident, after all, everyone has exp...
wenyang1986 stm32/stm8
IC Packaging Terminology Explained
Detailed explanation of IC packaging terms 1. BGA (ball grid array) 2. BQFP (quad flat package with bumper) 3. PGA (butt joint pin grid array).........
frozenviolet Analog electronics

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1462  1786  2364  2607  1042  30  36  48  53  21 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号