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74HC4067

Description
16-channel analog multiplexer/demultiplexer
File Size151KB,29 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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74HC4067 Overview

16-channel analog multiplexer/demultiplexer

74HC4067; 74HCT4067
16-channel analog multiplexer/demultiplexer
Rev. 03 — 15 October 2007
Product data sheet
1. General description
The 74HC4067; 74HCT4067 is a high-speed Si-gate CMOS device and is pin compatible
with the HEF4067B. The device is specified in compliance with JEDEC standard no. 7A.
The 74HC4067; 74HCT4067 is a 16-channel analog multiplexer/demultiplexer with four
address inputs (S0 to S3), an active-LOW enable input (E), sixteen independent
inputs/outputs (Y0 to Y15) and a common input/output (Z).
The 74HC4067; 74HCT4067 contains sixteen bidirectional analog switches, each with
one side connected to an independent input/output (Y0 to Y15) and the other side
connected to a common input/output (Z).
With pin E = LOW, one of the sixteen switches is selected by pins S0 to S3 (low
impedance ON-state). All unselected switches are in the high-impedance OFF-state.
With pin E = HIGH, all switches are in the high-impedance OFF-state, independent of pins
S0 to S3.
The analog inputs/outputs (Y0 to Y15, and Z) can swing between V
CC
as a positive limit
and GND as a negative limit. V
CC
to GND may not exceed 10 V.
2. Features
I
Low ON resistance:
N
80
(typical) at V
CC
= 4.5 V
N
70
(typical) at V
CC
= 6.0 V
N
60
(typical) at V
CC
= 9.0 V
I
Typical ‘break before make’ built-in
3. Applications
I
Analog multiplexing and demultiplexing
I
Digital multiplexing and demultiplexing
I
Signal gating

74HC4067 Related Products

74HC4067 74HC4067BQ 74HCT4067 74HCT4067N 74HC4067N 74HCT4067BQ
Description 16-channel analog multiplexer/demultiplexer 16-channel analog multiplexer/demultiplexer 16-channel analog multiplexer/demultiplexer 16-Channel Analog Multiplexer 16-channel analog multiplexer/demultiplexer 16-channel analog multiplexer/demultiplexer
Is it lead-free? - Contains lead - Lead free Lead free Contains lead
Is it Rohs certified? - conform to - conform to conform to conform to
Maker - NXP - NXP NXP NXP
Parts packaging code - QFN - DIP DIP QFN
package instruction - HVQCCN, LCC24/28,.14X.2,20 - 0.600 INCH, PLASTIC, MO-015, SC509-24, SOT101-1, DIP-24 DIP, DIP24,.6 HVQCCN, LCC24/28,.14X.2,20
Contacts - 24 - 24 24 24
Reach Compliance Code - compliant - unknown compliant compliant
Analog Integrated Circuits - Other Types - SINGLE-ENDED MULTIPLEXER - SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER
JESD-30 code - R-PQCC-N24 - R-PDIP-T24 R-PDIP-T24 R-PQCC-N24
JESD-609 code - e4 - e3 e2 e4
length - 5.5 mm - 31.7 mm 31.7 mm 5.5 mm
Number of channels - 16 - 16 16 16
Number of functions - 1 - 1 1 1
Number of terminals - 24 - 24 24 24
Nominal off-state isolation - 50 dB - 50 dB 50 dB 50 dB
On-state resistance matching specifications - 9 Ω - 9 Ω 9 Ω 9 Ω
Maximum on-state resistance (Ron) - 180 Ω - 180 Ω 180 Ω 180 Ω
Maximum operating temperature - 125 °C - 125 °C 125 °C 125 °C
Minimum operating temperature - -40 °C - -40 °C -40 °C -40 °C
Package body material - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - HVQCCN - DIP DIP HVQCCN
Encapsulate equivalent code - LCC24/28,.14X.2,20 - DIP24,.6 DIP24,.6 LCC24/28,.14X.2,20
Package shape - RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - IN-LINE IN-LINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) - 260 - NOT SPECIFIED NOT SPECIFIED 260
power supply - 2/9 V - 5 V 2/9 V 5 V
Certification status - Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height - 1 mm - 5.1 mm 5.1 mm 1 mm
Maximum supply current (Isup) - 50 mA - 0.08 mA 0.16 mA 50 mA
Maximum supply voltage (Vsup) - 10 V - 5.5 V 10 V 5.5 V
Minimum supply voltage (Vsup) - 2 V - 4.5 V 2 V 4.5 V
Nominal supply voltage (Vsup) - 5 V - 5 V 5 V 5 V
surface mount - YES - NO NO YES
Maximum disconnect time - 435 ns - 90 ns 435 ns 90 ns
Maximum connection time - 450 ns - 98 ns 450 ns 98 ns
switch - BREAK-BEFORE-MAKE - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
technology - CMOS - CMOS CMOS CMOS
Temperature level - AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface - Nickel/Palladium/Gold (Ni/Pd/Au) - Tin (Sn) Tin/Silver (Sn/Ag) NICKEL PALLADIUM GOLD
Terminal form - NO LEAD - THROUGH-HOLE THROUGH-HOLE NO LEAD
Terminal pitch - 0.5 mm - 2.54 mm 2.54 mm 0.5 mm
Terminal location - QUAD - DUAL DUAL QUAD
Maximum time at peak reflow temperature - 30 - NOT SPECIFIED NOT SPECIFIED 30
width - 3.5 mm - 15.24 mm 15.24 mm 3.5 mm
Base Number Matches - 1 - 1 1 1
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