16-channel analog multiplexer/demultiplexer

| 74HCT4067 | 74HC4067 | 74HC4067BQ | 74HCT4067N | 74HC4067N | 74HCT4067BQ | |
|---|---|---|---|---|---|---|
| Description | 16-channel analog multiplexer/demultiplexer | 16-channel analog multiplexer/demultiplexer | 16-channel analog multiplexer/demultiplexer | 16-Channel Analog Multiplexer | 16-channel analog multiplexer/demultiplexer | 16-channel analog multiplexer/demultiplexer |
| Is it lead-free? | - | - | Contains lead | Lead free | Lead free | Contains lead |
| Is it Rohs certified? | - | - | conform to | conform to | conform to | conform to |
| Maker | - | - | NXP | NXP | NXP | NXP |
| Parts packaging code | - | - | QFN | DIP | DIP | QFN |
| package instruction | - | - | HVQCCN, LCC24/28,.14X.2,20 | 0.600 INCH, PLASTIC, MO-015, SC509-24, SOT101-1, DIP-24 | DIP, DIP24,.6 | HVQCCN, LCC24/28,.14X.2,20 |
| Contacts | - | - | 24 | 24 | 24 | 24 |
| Reach Compliance Code | - | - | compliant | unknown | compliant | compliant |
| Analog Integrated Circuits - Other Types | - | - | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 code | - | - | R-PQCC-N24 | R-PDIP-T24 | R-PDIP-T24 | R-PQCC-N24 |
| JESD-609 code | - | - | e4 | e3 | e2 | e4 |
| length | - | - | 5.5 mm | 31.7 mm | 31.7 mm | 5.5 mm |
| Number of channels | - | - | 16 | 16 | 16 | 16 |
| Number of functions | - | - | 1 | 1 | 1 | 1 |
| Number of terminals | - | - | 24 | 24 | 24 | 24 |
| Nominal off-state isolation | - | - | 50 dB | 50 dB | 50 dB | 50 dB |
| On-state resistance matching specifications | - | - | 9 Ω | 9 Ω | 9 Ω | 9 Ω |
| Maximum on-state resistance (Ron) | - | - | 180 Ω | 180 Ω | 180 Ω | 180 Ω |
| Maximum operating temperature | - | - | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | - | HVQCCN | DIP | DIP | HVQCCN |
| Encapsulate equivalent code | - | - | LCC24/28,.14X.2,20 | DIP24,.6 | DIP24,.6 | LCC24/28,.14X.2,20 |
| Package shape | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | - | - | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 |
| power supply | - | - | 2/9 V | 5 V | 2/9 V | 5 V |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | - | 1 mm | 5.1 mm | 5.1 mm | 1 mm |
| Maximum supply current (Isup) | - | - | 50 mA | 0.08 mA | 0.16 mA | 50 mA |
| Maximum supply voltage (Vsup) | - | - | 10 V | 5.5 V | 10 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | - | 2 V | 4.5 V | 2 V | 4.5 V |
| Nominal supply voltage (Vsup) | - | - | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | - | YES | NO | NO | YES |
| Maximum disconnect time | - | - | 435 ns | 90 ns | 435 ns | 90 ns |
| Maximum connection time | - | - | 450 ns | 98 ns | 450 ns | 98 ns |
| switch | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | - | - | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Tin/Silver (Sn/Ag) | NICKEL PALLADIUM GOLD |
| Terminal form | - | - | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| Terminal pitch | - | - | 0.5 mm | 2.54 mm | 2.54 mm | 0.5 mm |
| Terminal location | - | - | QUAD | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | - | - | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 |
| width | - | - | 3.5 mm | 15.24 mm | 15.24 mm | 3.5 mm |
| Base Number Matches | - | - | 1 | 1 | 1 | 1 |