2N389 datasheet, PDF - EEWORLD Datasheet

2N389: DescriptionNPN, Si, POWER TRANSISTOR, HERMETIC SEALED PACKAGE-3; CategoryDiscrete semiconductor The transistor; File Size29KB，1 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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2N389 Overview

NPN, Si, POWER TRANSISTOR, HERMETIC SEALED PACKAGE-3

Parameter Name	Attribute value
package instruction	FLANGE MOUNT, O-MBFM-X3
Contacts	3
Reach Compliance Code	unknow
Shell connection	COLLECTOR
Configuration	SINGLE
Minimum DC current gain (hFE)	12
JESD-30 code	O-MBFM-X3
Number of components	1
Number of terminals	3
Maximum operating temperature	200 °C
Package body material	METAL
Package shape	ROUND
Package form	FLANGE MOUNT
Polarity/channel type	NPN
Maximum power dissipation(Abs)	85 W
Certification status	Not Qualified
surface mount	NO
Terminal form	UNSPECIFIED
Terminal location	BOTTOM
Transistor component materials	SILICON
Base Number Matches	1

	2N389	2N424
Description	NPN, Si, POWER TRANSISTOR, HERMETIC SEALED PACKAGE-3	NPN, Si, POWER TRANSISTOR, HERMETIC SEALED PACKAGE-3
package instruction	FLANGE MOUNT, O-MBFM-X3	FLANGE MOUNT, O-MBFM-X3
Contacts	3	3
Reach Compliance Code	unknow	unknow
Shell connection	COLLECTOR	COLLECTOR
Configuration	SINGLE	SINGLE
Minimum DC current gain (hFE)	12	12
JESD-30 code	O-MBFM-X3	O-MBFM-X3
Number of components	1	1
Number of terminals	3	3
Maximum operating temperature	200 °C	200 °C
Package body material	METAL	METAL
Package shape	ROUND	ROUND
Package form	FLANGE MOUNT	FLANGE MOUNT
Polarity/channel type	NPN	NPN
Maximum power dissipation(Abs)	85 W	85 W
Certification status	Not Qualified	Not Qualified
surface mount	NO	NO
Terminal form	UNSPECIFIED	UNSPECIFIED
Terminal location	BOTTOM	BOTTOM
Transistor component materials	SILICON	SILICON
Base Number Matches	1	1

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