Power Field-Effect Transistor, 14A I(D), 400V, 0.3ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, DIE-3
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIE-3 |
| Reach Compliance Code | compli |
| Avalanche Energy Efficiency Rating (Eas) | 700 mJ |
| Shell connection | DRAIN |
| Configuration | SINGLE |
| Minimum drain-source breakdown voltage | 400 V |
| Maximum drain current (Abs) (ID) | 14 A |
| Maximum drain current (ID) | 14 A |
| Maximum drain-source on-resistance | 0.3 Ω |
| FET technology | METAL-OXIDE SEMICONDUCTOR |
| JESD-30 code | S-XUUC-N3 |
| JESD-609 code | e0 |
| Number of components | 1 |
| Number of terminals | 3 |
| Operating mode | ENHANCEMENT MODE |
| Maximum operating temperature | 150 °C |
| Package body material | UNSPECIFIED |
| Package shape | SQUARE |
| Package form | UNCASED CHIP |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | N-CHANNEL |
| Maximum power dissipation(Abs) | 150 W |
| Maximum pulsed drain current (IDM) | 56 A |
| Certification status | Qualified |
| Guideline | MIL-19500/543G |
| surface mount | YES |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |
| Base Number Matches | 1 |

| JANHCA2N6768 | JANTXV2N6768 | JANTX2N6768 | JANHCA2N6764 | JANHCA2N6766 | JANTXV2N6764 | JANHCA2N6770 | JANTX2N6764 | JANTXV2N6766 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Power Field-Effect Transistor, 14A I(D), 400V, 0.3ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, DIE-3 | Power Field-Effect Transistor, 14A I(D), 400V, 0.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204, HERMETIC SEALED, TO-204, 2 PIN | Power Field-Effect Transistor, 14A I(D), 400V, 0.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204, HERMETIC SEALED, TO-204, 2 PIN | Power Field-Effect Transistor, 38A I(D), 100V, 0.055ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, DIE-3 | Power Field-Effect Transistor, 30A I(D), 200V, 0.085ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, DIE-3 | Power Field-Effect Transistor, 38A I(D), 100V, 0.065ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204, HERMETIC SEALED, TO-204, 2 PIN | Power Field-Effect Transistor, 12A I(D), 500V, 0.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, DIE-3 | Power Field-Effect Transistor, 38A I(D), 100V, 0.065ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204, HERMETIC SEALED, TO-204, 2 PIN | Power Field-Effect Transistor, 30A I(D), 200V, 0.09ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204, HERMETIC SEALED, TO-204, 2 PIN |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIE-3 | TO-204, 2 PIN | TO-204, 2 PIN | DIE-3 | DIE-3 | TO-204, 2 PIN | DIE-3 | TO-204, 2 PIN | HERMETIC SEALED, TO-204, 2 PIN |
| Reach Compliance Code | compli | compli | compli | compliant | unknown | unknown | unknown | unknown | unknown |
| Avalanche Energy Efficiency Rating (Eas) | 700 mJ | 11.3 mJ | 11.3 mJ | 150 mJ | 500 mJ | 150 mJ | 750 mJ | 150 mJ | 60 mJ |
| Shell connection | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN |
| Configuration | SINGLE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE | SINGLE | SINGLE WITH BUILT-IN DIODE | SINGLE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage | 400 V | 400 V | 400 V | 100 V | 200 V | 100 V | 500 V | 100 V | 200 V |
| Maximum drain current (Abs) (ID) | 14 A | 14 A | 14 A | 38 A | 30 A | 38 A | 12 A | 38 A | 30 A |
| Maximum drain current (ID) | 14 A | 14 A | 14 A | 38 A | 30 A | 38 A | 12 A | 38 A | 30 A |
| Maximum drain-source on-resistance | 0.3 Ω | 0.4 Ω | 0.4 Ω | 0.055 Ω | 0.085 Ω | 0.065 Ω | 0.4 Ω | 0.065 Ω | 0.09 Ω |
| FET technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
| JESD-30 code | S-XUUC-N3 | O-MBFM-P2 | O-MBFM-P2 | S-XUUC-N3 | S-XUUC-N3 | O-MBFM-P2 | S-XUUC-N3 | O-MBFM-P2 | O-MBFM-P2 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 3 | 2 | 2 | 3 | 3 | 2 | 3 | 2 | 2 |
| Operating mode | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
| Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
| Package body material | UNSPECIFIED | METAL | METAL | UNSPECIFIED | UNSPECIFIED | METAL | UNSPECIFIED | METAL | METAL |
| Package shape | SQUARE | ROUND | ROUND | SQUARE | SQUARE | ROUND | SQUARE | ROUND | ROUND |
| Package form | UNCASED CHIP | FLANGE MOUNT | FLANGE MOUNT | UNCASED CHIP | UNCASED CHIP | FLANGE MOUNT | UNCASED CHIP | FLANGE MOUNT | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Polarity/channel type | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
| Maximum power dissipation(Abs) | 150 W | 150 W | 150 W | 150 W | 150 W | 150 W | 150 W | 150 W | 150 W |
| Maximum pulsed drain current (IDM) | 56 A | 56 A | 56 A | 152 A | 120 A | 152 A | 48 A | 152 A | 120 A |
| Certification status | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| Guideline | MIL-19500/543G | MIL-19500/543 | MIL-19500/543 | MIL-19500/543G | MIL-19500/543G | MIL-19500/543 | MIL-19500/543G | MIL-19500/543 | MIL-19500/543 |
| surface mount | YES | NO | NO | YES | YES | NO | YES | NO | NO |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | PIN/PEG | PIN/PEG | NO LEAD | NO LEAD | PIN/PEG | NO LEAD | PIN/PEG | PIN/PEG |
| Terminal location | UPPER | BOTTOM | BOTTOM | UPPER | UPPER | BOTTOM | UPPER | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| transistor applications | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| Transistor component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| Other features | - | HIGH RELIABILITY | HIGH RELIABILITY | - | - | HIGH RELIABILITY | - | HIGH RELIABILITY | HIGH RELIABILITY |
| JEDEC-95 code | - | TO-204 | TO-204 | - | - | TO-204 | - | TO-204 | TO-204 |
| Maker | - | - | - | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |