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74HCT04

Description
CERAMIC CHIP/MIL-PRF-55681
CategoryPassive components   
File Size117KB,7 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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74HCT04 Overview

CERAMIC CHIP/MIL-PRF-55681

74HCT04
Hex Inverter
With LSTTL−Compatible Inputs
High−Performance Silicon−Gate CMOS
The 74HCT04 may be used as a level converter for interfacing TTL
or NMOS outputs to High−Speed CMOS inputs. The HCT04A is
identical in pinout to the LS04.
Features
http://onsemi.com
MARKING
DIAGRAMS
14
14
1
SOIC−14
D SUFFIX
CASE 751A
1
HCT04G
AWLYWW
Output Drive Capability: 10 LSTTL Loads
TTL/NMOS−Compatible Input Levels
Outputs Directly Interface to CMOS, NMOS and TTL
Operating Voltage Range: 4.5 to 5.5 V
Low Input Current: 1.0
mA
In Compliance With the JEDEC Standard No. 7A Requirements
ESD Performance: HBM
>
2000 V; Machine Model
>
200 V
Chip Complexity: 48 FETs or 12 Equivalent Gates
These are Pb−Free Devices
14
14
1
TSSOP−14
DT SUFFIX
CASE 948G
1
HCT04
A
L, WL
Y
W, WW
G or
G
HCT
04
ALYWG
G
= Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
©
Semiconductor Components Industries, LLC, 2007
March, 2007
Rev. 1
1
Publication Order Number:
74HCT04/D

74HCT04 Related Products

74HCT04 74HCT04DR2G 74HCT04DTR2G
Description CERAMIC CHIP/MIL-PRF-55681 HCT SERIES, HEX 1-INPUT INVERT GATE, PDSO14 HCT SERIES, HEX 1-INPUT INVERT GATE, PDSO14
Is it Rohs certified? - conform to conform to
Parts packaging code - SOIC TSSOP
package instruction - SOP, SOP14,.25 TSSOP, TSSOP14,.25
Contacts - 14 14
Reach Compliance Code - unknown unknown
Factory Lead Time - 1 week 1 week
series - HCT HCT
JESD-30 code - R-PDSO-G14 R-PDSO-G14
JESD-609 code - e3 e4
length - 8.65 mm 5 mm
Load capacitance (CL) - 50 pF 50 pF
Logic integrated circuit type - INVERTER INVERTER
MaximumI(ol) - 0.004 A 0.004 A
Humidity sensitivity level - 1 1
Number of functions - 6 6
Number of entries - 1 1
Number of terminals - 14 14
Maximum operating temperature - 125 °C 125 °C
Minimum operating temperature - -55 °C -55 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SOP TSSOP
Encapsulate equivalent code - SOP14,.25 TSSOP14,.25
Package shape - RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing - TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) - 260 260
power supply - 5 V 5 V
Prop。Delay @ Nom-Sup - 26 ns 26 ns
propagation delay (tpd) - 26 ns 26 ns
Certification status - Not Qualified Not Qualified
Schmitt trigger - NO NO
Maximum seat height - 1.75 mm 1.2 mm
Maximum supply voltage (Vsup) - 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 4.5 V 4.5 V
Nominal supply voltage (Vsup) - 5 V 5 V
surface mount - YES YES
technology - CMOS CMOS
Temperature level - MILITARY MILITARY
Terminal surface - Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form - GULL WING GULL WING
Terminal pitch - 1.27 mm 0.65 mm
Terminal location - DUAL DUAL
Maximum time at peak reflow temperature - 40 40
width - 3.9 mm 4.4 mm
Base Number Matches - 1 1
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