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SMMD837-SOD323

Description
Step Recovery Diode, Silicon, PLASTIC PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size609KB,8 Pages
ManufacturerCobham Semiconductor Solutions
Environmental Compliance  
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SMMD837-SOD323 Overview

Step Recovery Diode, Silicon, PLASTIC PACKAGE-2

SMMD837-SOD323 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerCobham Semiconductor Solutions
package instructionR-PDSO-G2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresHIGH EFFICIENCY
Minimum breakdown voltage20 V
ConfigurationSINGLE
Maximum diode capacitance0.4 pF
Minimum diode capacitance0.2 pF
Diode component materialsSILICON
Diode typeSTEP RECOVERY DIODE
JESD-30 codeR-PDSO-G2
JESD-609 codee3
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum power dissipation0.25 W
Certification statusNot Qualified
surface mountYES
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Silicon Step Recovery Diodes
Description
The diodes feature fully passivated, true mesa construction for
sharp transitions and improved stability. The beam lead SRDs
have the industry’s fastest transition times for millimeter wave
multiplication and picosecond pulse forming.
Features
Output combs to 40+ GHz
Transition times down to 35 ps
Screening per MIL-PRF-19500
and MIL-PRF-38534 available
Absolute Maximum Ratings
(Chip and Beam Lead)
Parameters
Reverse Voltage
Forward Current
Rated V
BR
50 mA (Beam Lead)
150 mA (Chip)
Power Dissipation
150
°C
/
JC
Rating
at T
HSK
= +25
°C
Derate linearly to zero at T
HSK
= +175
°C
Junction Temperature
Storage Temperature
Mounting / Bonding Temperature
-65
°C
to +175
°C
-65
°C
to +175
°C
+235
°C
for 10 seconds (Beam Lead)
+310
°C
for 30 seconds (Chip)
Chip and Beam Lead
V
BR
C
J
MIN
pF
C
J
MAX
pF
MIN
ns
TYP
ns
t
t
TYP
ps
t
t
MAX
ps
F
CO
TYP
GHz
JC
Model
MMDB30-B1
1
MMDB35-B1
1
MMDB45-B1
1
MMD805-C1
2
MMD810-C1
2
MMD820-C1
2
MMD830-C1
1
MMD832-C1
1
MMD835-C1
1
MMD837-C1
1
MMD840-C1
1
MIN
V
MAX
°C/W
Package
B1
1
B1
1
B1
1
C1
2
C1
2
C1
2
C1
1
C1
1
C1
1
C1
1
C1
1
1
4
16
25
60
50
40
25
20
1
5
20
1
5
I
R
=
10 A
0.1
5
0.1
3
0.1
1
2.5
1.5
1.0
0.5
0.4
0.3
0.2
0.2
0.25
0.20
0.20
3.5
2.5
1.7
1.0
0.8
0.7
0.4
0.4
1.0
1.0
3.0
80
40
30
1
5
10
10
5
7
4.0
4.0
8.0
100
70
60
30
1
5
20
10
1
5
30
35
45
250
200
80
60
60
60
60
60
I
F
= 3 mA
V
R
= 7 V
38
45
58
300
250
100
80
80
70
70
70
530
482
410
1
30
200
390
700
660
800
1,300
880
F
CO
=
1 / 2 R
S
600
600
600
1
5
22
25
45
50
60
60
60
I
F
= 10 mA
Test Conditions
V
R
= 6 V
F = 1 MHz
I
R
= 6 mA
Measured at
50% Recovery
I
F
= 10 mA
V
R
= 10 V
Revision Date: 09/23/05

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