DS2505P+TR datasheet, PDF - EEWORLD Datasheet

DS2505P+TR: Description16K X 1 OTPROM, PDSO6; Categorystorage; File Size480KB，1 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html

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DS2505P+TR Overview

16K X 1 OTPROM, PDSO6

Parameter Name	Attribute value
Number of functions	1
Number of terminals	6
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	6 V
Minimum supply/operating voltage	2.8 V
Rated supply voltage	5 V
Processing package description	3.70 X 4 MM, 1.50 MM HEIGHT, TSOC-6
state	ACTIVE
Craftsmanship	MOS
packaging shape	RECTANGULAR
Package Size	SMALL OUTLINE
surface mount	Yes
Terminal form	C BEND
Terminal spacing	1.27 mm
terminal coating	TIN LEAD
Terminal location	DUAL
Packaging Materials	PLASTIC/EPOXY
Temperature level	INDUSTRIAL
memory width	1
organize	16K X 1
storage density	16384 deg
operating mode	ASYNCHRONOUS
Number of digits	16384 words
Number of digits	16K
Memory IC type	OTPROM
serial parallel	SERIAL

EDEN CHEN

04/12/11

	DS2505P+TR	DS2505/TR	DS2505+TR	DS2505P/TR
Description	16K X 1 OTPROM, PDSO6	16K X 1 OTPROM, PDSO6	16K X 1 OTPROM, PDSO6	16K X 1 OTPROM, PDSO6
Number of functions	1	1	1	1
Number of terminals	6	6	6	6
Maximum operating temperature	85 Cel	85 Cel	85 Cel	85 Cel
Minimum operating temperature	-40 Cel	-40 Cel	-40 Cel	-40 Cel
Maximum supply/operating voltage	6 V	6 V	6 V	6 V
Minimum supply/operating voltage	2.8 V	2.8 V	2.8 V	2.8 V
Rated supply voltage	5 V	5 V	5 V	5 V
Processing package description	3.70 X 4 MM, 1.50 MM HEIGHT, TSOC-6	3.70 X 4 MM, 1.50 MM HEIGHT, TSOC-6	3.70 X 4 MM, 1.50 MM HEIGHT, TSOC-6	3.70 X 4 MM, 1.50 MM HEIGHT, TSOC-6
state	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Craftsmanship	MOS	MOS	MOS	MOS
packaging shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package Size	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
surface mount	Yes	Yes	Yes	Yes
Terminal form	C BEND	C BEND	C BEND	C BEND
Terminal spacing	1.27 mm	1.27 mm	1.27 mm	1.27 mm
terminal coating	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL
Packaging Materials	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
memory width	1	1	1	1
organize	16K X 1	16K X 1	16K X 1	16K X 1
storage density	16384 deg	16384 deg	16384 deg	16384 deg
operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Memory IC type	OTPROM	OTPROM	OTPROM	OTPROM
serial parallel	SERIAL	SERIAL	SERIAL	SERIAL
Number of digits	16K	16K	16K	16K

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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