SN74AUP2G125YFPR datasheet, PDF

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SN74AUP2G125YFPR: DescriptionLow-Power Dual Bus Buffer Gate With 3-State Outputs 8-DSBGA -40 to 85; Categorylogic logic; File Size1MB，26 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74AUP2G125YFPR Overview

Low-Power Dual Bus Buffer Gate With 3-State Outputs 8-DSBGA -40 to 85

SN74AUP2G125YFPR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	VFBGA, BGA8,2X4,16
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	1 week
Control type	ENABLE LOW
Counting direction	UNIDIRECTIONAL
series	AUP/ULP/V
JESD-30 code	R-PBGA-B8
JESD-609 code	e1
length	1.57 mm
Load capacitance (CL)	30 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.004 A
Humidity sensitivity level	1
Number of digits	1
Number of functions	2
Number of ports	2
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA8,2X4,16
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power supply	1.2/3.3 V
Maximum supply current (ICC)	0.0009 mA
Prop。Delay @ Nom-Su	31.1 ns
propagation delay (tpd)	4.6 ns
Certification status	Not Qualified
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	0.8 V
Nominal supply voltage (Vsup)	1.1 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.4 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
translate	N/A
width	0.77 mm

SN74AUP2G125YFPR Related Products

	SN74AUP2G125YFPR	SN74AUP2G125DCUR	SN74AUP2G125RSER	SN74AUP2G125DQER	SN74AUP2G125YZPR
Description	Low-Power Dual Bus Buffer Gate With 3-State Outputs 8-DSBGA -40 to 85	Low-Power Dual Bus Buffer Gate With 3-State Outputs 8-VSSOP -40 to 85	Low-Power Dual Bus Buffer Gate With 3-State Outputs 8-UQFN -40 to 85	Low-Power Dual Bus Buffer Gate With 3-State Outputs 8-X2SON -40 to 85	Low-Power Dual Bus Buffer Gate With 3-State Outputs 8-DSBGA -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	SOIC	QFN	SON	BGA
package instruction	VFBGA, BGA8,2X4,16	VSSOP, TSSOP8,.12,20	VQCCN, LCC8,.06SQ,20	VSON, SOLCC8,.04,14	VFBGA, BGA8,2X4,20
Contacts	8	8	8	8	8
Reach Compliance Code	compli	compli	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Factory Lead Time	1 week	6 weeks	6 weeks	6 weeks	1 week
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
Counting direction	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL
series	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V
JESD-30 code	R-PBGA-B8	R-PDSO-G8	S-PQCC-N8	R-PDSO-N8	R-PBGA-B8
JESD-609 code	e1	e4	e4	e4	e1
length	1.57 mm	2.3 mm	1.5 mm	1.4 mm	1.9 mm
Load capacitance (CL)	30 pF	30 pF	30 pF	30 pF	30 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Humidity sensitivity level	1	1	1	1	1
Number of digits	1	1	1	1	1
Number of functions	2	2	2	2	2
Number of ports	2	2	2	2	2
Number of terminals	8	8	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VSSOP	VQCCN	VSON	VFBGA
Encapsulate equivalent code	BGA8,2X4,16	TSSOP8,.12,20	LCC8,.06SQ,20	SOLCC8,.04,14	BGA8,2X4,20
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	CHIP CARRIER, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TR	TR	TR	TR	TR
Peak Reflow Temperature (Celsius)	260	260	260	260	260
power supply	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V
Maximum supply current (ICC)	0.0009 mA	0.0009 mA	0.0009 mA	0.0009 mA	0.0009 mA
Prop。Delay @ Nom-Su	31.1 ns	31.1 ns	31.1 ns	31.1 ns	31.1 ns
propagation delay (tpd)	4.6 ns	4.6 ns	4.6 ns	31.1 ns	4.6 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.5 mm	0.9 mm	0.6 mm	0.4 mm	0.5 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	0.8 V	0.8 V	0.8 V	0.8 V	0.8 V
Nominal supply voltage (Vsup)	1.1 V	1.1 V	1.1 V	1.2 V	1.1 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	GULL WING	NO LEAD	NO LEAD	BALL
Terminal pitch	0.4 mm	0.5 mm	0.5 mm	0.35 mm	0.5 mm
Terminal location	BOTTOM	DUAL	QUAD	DUAL	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
translate	N/A	N/A	N/A	N/A	N/A
width	0.77 mm	2 mm	1.5 mm	1 mm	0.9 mm
Maker	Texas Instruments	Texas Instruments	-	-	Texas Instruments

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