DS90LV027AMDC datasheet, PDF - EEWORLD Datasheet

DS90LV027AMDC: DescriptionIC DUAL LINE DRIVER, UUC, DIE, Line Driver or Receiver; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size260KB，10 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DS90LV027AMDC Overview

IC DUAL LINE DRIVER, UUC, DIE, Line Driver or Receiver

Parameter Name	Attribute value
Maker	National Semiconductor（TI ）
package instruction	DIE, DIE OR CHIP
Reach Compliance Code	unknown
ECCN code	EAR99
Differential output	YES
Number of drives	2
High level input current maximum value	0.00001 A
Input properties	STANDARD
Interface integrated circuit type	LINE DRIVER
Interface standards	EIA-644; TIA-644
JESD-30 code	X-XUUC-N
Number of functions	2
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Minimum output swing	0.25 V
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	DIE OR CHIP
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
power supply	3.3 V
Certification status	Not Qualified
Maximum receive delay
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal location	UPPER
maximum transmission delay	1.5 ns

	DS90LV027AMDC	DS90LV027AMWC
Description	IC DUAL LINE DRIVER, UUC, DIE, Line Driver or Receiver	IC DUAL LINE DRIVER, UUC, WAFER, Line Driver or Receiver
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	DIE, DIE OR CHIP	DIE, WAFER
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Differential output	YES	YES
Number of drives	2	2
High level input current maximum value	0.00001 A	0.00001 A
Input properties	STANDARD	STANDARD
Interface integrated circuit type	LINE DRIVER	LINE DRIVER
Interface standards	EIA-644; TIA-644	EIA-644; TIA-644
JESD-30 code	X-XUUC-N	X-XUUC-N
Number of functions	2	2
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Minimum output swing	0.25 V	0.25 V
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIE	DIE
Encapsulate equivalent code	DIE OR CHIP	WAFER
Package shape	UNSPECIFIED	UNSPECIFIED
Package form	UNCASED CHIP	UNCASED CHIP
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Maximum supply voltage	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER
maximum transmission delay	1.5 ns	1.5 ns

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