
Cache SRAM, 2MX18, 7.5ns, CMOS, PQFP100, 20 X 14 MM, ROHS COMPLIANT, LQFP-100
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | SAMSUNG |
| Parts packaging code | QFP |
| package instruction | LQFP, QFP100,.63X.87 |
| Contacts | 100 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 7.5 ns |
| Other features | ALSO OPERATES AT 3.3V |
| Maximum clock frequency (fCLK) | 117 MHz |
| I/O type | COMMON |
| JESD-30 code | R-PQFP-G100 |
| length | 20 mm |
| memory density | 37748736 bit |
| Memory IC Type | CACHE SRAM |
| memory width | 18 |
| Humidity sensitivity level | 2 |
| Number of functions | 1 |
| Number of terminals | 100 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2MX18 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LQFP |
| Encapsulate equivalent code | QFP100,.63X.87 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 2.5/3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Minimum standby current | 2.38 V |
| Maximum slew rate | 0.29 mA |
| Maximum supply voltage (Vsup) | 2.625 V |
| Minimum supply voltage (Vsup) | 2.375 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 40 |
| width | 14 mm |

| K7B321835C-PI750 | K7B323635C-PI750 | K7B323635C-PC750 | K7B323635C-PC75T | K7B323635C-QI750 | K7B323635C-QC750 | K7B321835C-PC750 | K7B321835C-QC750 | K7B321835C-QI750 | K7B323635C-QC75T | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Cache SRAM, 2MX18, 7.5ns, CMOS, PQFP100, 20 X 14 MM, ROHS COMPLIANT, LQFP-100 | Cache SRAM, 1MX36, 7.5ns, CMOS, PQFP100, 20 X 14 MM, ROHS COMPLIANT, LQFP-100 | Cache SRAM, 1MX36, 7.5ns, CMOS, PQFP100, 20 X 14 MM, ROHS COMPLIANT, LQFP-100 | Standard SRAM, 1MX36, 7.5ns, CMOS, PQFP100, | Cache SRAM, 1MX36, 7.5ns, CMOS, PQFP100, 20 X 14 MM, LQFP-100 | Cache SRAM, 1MX36, 7.5ns, CMOS, PQFP100, 20 X 14 MM, LQFP-100 | Cache SRAM, 2MX18, 7.5ns, CMOS, PQFP100, 20 X 14 MM, ROHS COMPLIANT, LQFP-100 | Cache SRAM, 2MX18, 7.5ns, CMOS, PQFP100, 20 X 14 MM, LQFP-100 | Cache SRAM, 2MX18, 7.5ns, CMOS, PQFP100, 20 X 14 MM, LQFP-100 | Standard SRAM, 1MX36, 7.5ns, CMOS, PQFP100 |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | incompatible | incompatible | conform to | incompatible | incompatible | incompatible |
| Reach Compliance Code | compliant | unknown | unknown | unknown | compliant | compliant | compli | compli | compli | unknown |
| Maximum access time | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns |
| Maximum clock frequency (fCLK) | 117 MHz | 117 MHz | 117 MHz | 117 MHz | 117 MHz | 117 MHz | 117 MHz | 117 MHz | 117 MHz | 117 MHz |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| memory density | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bi | 37748736 bi | 37748736 bi | 37748736 bit |
| Memory IC Type | CACHE SRAM | CACHE SRAM | CACHE SRAM | STANDARD SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | STANDARD SRAM |
| memory width | 18 | 36 | 36 | 36 | 36 | 36 | 18 | 18 | 18 | 36 |
| Number of terminals | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| word count | 2097152 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 2097152 words | 2097152 words | 2097152 words | 1048576 words |
| character code | 2000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 2000000 | 2000000 | 2000000 | 1000000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| organize | 2MX18 | 1MX36 | 1MX36 | 1MX36 | 1MX36 | 1MX36 | 2MX18 | 2MX18 | 2MX18 | 1MX36 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LQFP | LQFP | LQFP | QFP | LQFP | LQFP | LQFP | LQFP | LQFP | QFP |
| Encapsulate equivalent code | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED | 260 | 260 | 230 | 230 | 260 | 230 | 230 | 260 |
| power supply | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Minimum standby current | 2.38 V | 2.38 V | 2.38 V | 2.38 V | 2.38 V | 2.38 V | 2.38 V | 2.38 V | 2.38 V | 2.38 V |
| Maximum slew rate | 0.29 mA | 0.29 mA | 0.29 mA | 0.29 mA | 0.29 mA | 0.29 mA | 0.29 mA | 0.29 mA | 0.29 mA | 0.29 mA |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.635 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.635 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | 40 | NOT SPECIFIED | 40 | 40 | 30 | 30 | 40 | 30 | 30 | 40 |
| Maker | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | - |
| Parts packaging code | QFP | QFP | QFP | - | QFP | QFP | QFP | QFP | QFP | - |
| package instruction | LQFP, QFP100,.63X.87 | 20 X 14 MM, ROHS COMPLIANT, LQFP-100 | 20 X 14 MM, ROHS COMPLIANT, LQFP-100 | - | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | QFP, QFP100,.63X.87 |
| Contacts | 100 | 100 | 100 | - | 100 | 100 | 100 | 100 | 100 | - |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| Other features | ALSO OPERATES AT 3.3V | ALSO OPERATES AT 3.3V | ALSO OPERATES AT 3.3V | - | ALSO OPERATES AT 3.3V | ALSO OPERATES AT 3.3V | ALSO OPERATES AT 3.3V | ALSO OPERATES AT 3.3V | ALSO OPERATES AT 3.3V | - |
| length | 20 mm | 20 mm | 20 mm | - | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | - |
| Humidity sensitivity level | 2 | 3 | 3 | 3 | - | - | 2 | - | - | 3 |
| Number of functions | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | - |
| Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm | - | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | - |
| Maximum supply voltage (Vsup) | 2.625 V | 2.625 V | 2.625 V | - | 2.625 V | 2.625 V | 2.625 V | 2.625 V | 2.625 V | - |
| Minimum supply voltage (Vsup) | 2.375 V | 2.375 V | 2.375 V | - | 2.375 V | 2.375 V | 2.375 V | 2.375 V | 2.375 V | - |
| Nominal supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
| width | 14 mm | 14 mm | 14 mm | - | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | - |
| JESD-609 code | - | e6 | e6 | e6 | e0 | e0 | - | e0 | e0 | e1 |
| Terminal surface | - | Tin/Bismuth (Sn97Bi3) | Tin/Bismuth (Sn97Bi3) | Tin/Bismuth (Sn97Bi3) | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN SILVER COPPER |