|
IRFD211 |
IRFD213R |
IRFD213 |
IRFD211R |
IRFD210R |
IRFD212 |
IRFD212R |
| Description |
600mA, 150V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
450mA, 150V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
450mA, 150V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
600mA, 150V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
600mA, 200V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
450mA, 200V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
450mA, 200V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
| Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
_compli |
_compli |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Shell connection |
DRAIN |
DRAIN |
DRAIN |
DRAIN |
DRAIN |
DRAIN |
DRAIN |
| Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage |
150 V |
150 V |
150 V |
150 V |
200 V |
200 V |
200 V |
| Maximum drain current (Abs) (ID) |
0.6 A |
0.45 A |
0.45 A |
0.6 A |
0.6 A |
0.45 A |
0.45 A |
| Maximum drain current (ID) |
0.6 A |
0.45 A |
0.45 A |
0.6 A |
0.6 A |
0.45 A |
0.45 A |
| Maximum drain-source on-resistance |
1.5 Ω |
2.4 Ω |
2.4 Ω |
1.5 Ω |
1.5 Ω |
2.4 Ω |
2.4 Ω |
| FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
| JESD-30 code |
R-PDIP-T3 |
R-PDIP-T3 |
R-PDIP-T3 |
R-PDIP-T3 |
R-PDIP-T3 |
R-PDIP-T3 |
R-PDIP-T3 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| Number of components |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
| Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
| Maximum operating temperature |
150 °C |
150 °C |
150 °C |
150 °C |
150 °C |
150 °C |
150 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
| Maximum power dissipation(Abs) |
1 W |
1 W |
1 W |
1 W |
1 W |
1 W |
1 W |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| surface mount |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
| Transistor component materials |
SILICON |
SILICON |
SILICON |
SILICON |
SILICON |
SILICON |
SILICON |