EE PLD, 15ns, 64-Cell, CMOS, PQCC44,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Lattice |
| package instruction | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Other features | NO |
| In-system programmable | NO |
| JESD-30 code | S-PQCC-J44 |
| JESD-609 code | e0 |
| JTAG BST | NO |
| Humidity sensitivity level | 3 |
| Number of macro cells | 64 |
| Number of terminals | 44 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC44,.7SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 3.3 V |
| Programmable logic type | EE PLD |
| propagation delay | 15 ns |
| Certification status | Not Qualified |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| PLSI2064V-80LJ44 | PLSI2064V-100LJ44 | PLSI2064V-100LJ84 | PLSI2064V-60LJ44 | |
|---|---|---|---|---|
| Description | EE PLD, 15ns, 64-Cell, CMOS, PQCC44, | EE PLD, 12ns, 64-Cell, CMOS, PQCC44, | EE PLD, 12ns, 64-Cell, CMOS, PQCC84, | EE PLD, 20ns, 64-Cell, CMOS, PQCC44, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Lattice | Lattice | Lattice | Lattice |
| package instruction | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | NO | NO | NO | NO |
| In-system programmable | NO | NO | NO | NO |
| JESD-30 code | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J84 | S-PQCC-J44 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| JTAG BST | NO | NO | NO | NO |
| Humidity sensitivity level | 3 | 3 | 3 | 3 |
| Number of macro cells | 64 | 64 | 64 | 64 |
| Number of terminals | 44 | 44 | 84 | 44 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC44,.7SQ | LDCC44,.7SQ | LDCC84,1.2SQ | LDCC44,.7SQ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Programmable logic type | EE PLD | EE PLD | EE PLD | EE PLD |
| propagation delay | 15 ns | 12 ns | 12 ns | 20 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD |
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