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SE556-1CF

Description
IC DUAL PULSE, 0.5 MHz, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function
CategoryAnalog mixed-signal IC    The signal circuit   
File Size155KB,6 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

SE556-1CF Overview

IC DUAL PULSE, 0.5 MHz, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function

SE556-1CF Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeDIP
package instructionDIP, DIP14,.3
Contacts14
Reach Compliance Codeunknown
JESD-30 codeR-CDIP-T14
JESD-609 codee0
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5/15 V
Certification statusNot Qualified
surface mountNO
technologyBIPOLAR
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

SE556-1CF Related Products

SE556-1CF SE556-1F SE556CN SE556-1N SA556-1N SE556-1CN SA556-1F
Description IC DUAL PULSE, 0.5 MHz, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function IC DUAL PULSE, 0.5 MHz, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function IC DUAL PULSE, TIMER, PDIP14, Analog Waveform Generation Function IC DUAL PULSE, 0.5 MHz, TIMER, PDIP14, Analog Waveform Generation Function IC DUAL PULSE, 0.5 MHz, TIMER, PDIP14, Analog Waveform Generation Function IC DUAL PULSE, 0.5 MHz, TIMER, PDIP14, Analog Waveform Generation Function IC DUAL PULSE, 0.5 MHz, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function
package instruction DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-CDIP-T14 R-CDIP-T14 R-PDIP-T14 R-PDIP-T14 R-PDIP-T14 R-PDIP-T14 R-CDIP-T14
JESD-609 code e0 e0 e0 e0 e0 e0 e0
Number of terminals 14 14 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 85 °C 125 °C 85 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -40 °C -55 °C -40 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO NO NO NO
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level MILITARY MILITARY MILITARY MILITARY INDUSTRIAL MILITARY INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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