SE556-1CN datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Analog mixed-signal IC> The signal circuit> SE556-1CN

SE556-1CN: DescriptionIC DUAL PULSE, 0.5 MHz, TIMER, PDIP14, Analog Waveform Generation Function; CategoryAnalog mixed-signal IC The signal circuit; File Size155KB，6 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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SE556-1CN Overview

IC DUAL PULSE, 0.5 MHz, TIMER, PDIP14, Analog Waveform Generation Function

SE556-1CN Parametric

Parameter Name	Attribute value
Maker	NXP
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T14
JESD-609 code	e0
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5/15 V
Certification status	Not Qualified
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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SE556-1CN Related Products

	SE556-1CN	SE556-1F	SE556CN	SE556-1N	SE556-1CF	SA556-1N	SA556-1F
Description	IC DUAL PULSE, 0.5 MHz, TIMER, PDIP14, Analog Waveform Generation Function	IC DUAL PULSE, 0.5 MHz, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function	IC DUAL PULSE, TIMER, PDIP14, Analog Waveform Generation Function	IC DUAL PULSE, 0.5 MHz, TIMER, PDIP14, Analog Waveform Generation Function	IC DUAL PULSE, 0.5 MHz, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function	IC DUAL PULSE, 0.5 MHz, TIMER, PDIP14, Analog Waveform Generation Function	IC DUAL PULSE, 0.5 MHz, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T14	R-CDIP-T14	R-PDIP-T14	R-PDIP-T14	R-CDIP-T14	R-PDIP-T14	R-CDIP-T14
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	14	14	14	14	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maker	NXP	-	-	-	NXP	NXP	NXP

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