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40C80B

Description
Silicon Controlled Rectifier
CategoryAnalog mixed-signal IC    Trigger device   
File Size165KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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40C80B Overview

Silicon Controlled Rectifier

40C80B Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeTO-65
package instructionPOST/STUD MOUNT, O-MUPM-D2
Contacts2
Reach Compliance Codeunknown
Nominal circuit commutation break time100 µs
ConfigurationSINGLE
Critical rise rate of minimum off-state voltage200 V/us
Maximum DC gate trigger current100 mA
Maximum DC gate trigger voltage3 V
Maximum holding current200 mA
JEDEC-95 codeTO-208AC
JESD-30 codeO-MUPM-D2
JESD-609 codee0
Number of components1
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-65 °C
Package body materialMETAL
Package shapeROUND
Package formPOST/STUD MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum rms on-state current63 A
Maximum repetitive peak off-state leakage current6000 µA
Off-state repetitive peak voltage800 V
Repeated peak reverse voltage800 V
surface mountNO
Terminal surfaceTIN LEAD
Terminal formSOLDER LUG
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
Trigger device typeSCR
Base Number Matches1

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Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead -
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible -
Maker Microsemi Microsemi Microsemi Microsemi Microsemi Microsemi -
Parts packaging code TO-65 TO-65 TO-65 TO-65 TO-65 TO-65 -
package instruction POST/STUD MOUNT, O-MUPM-D2 POST/STUD MOUNT, O-MUPM-D2 POST/STUD MOUNT, O-MUPM-D2 POST/STUD MOUNT, O-MUPM-D2 POST/STUD MOUNT, O-MUPM-D2 POST/STUD MOUNT, O-MUPM-D2 -
Contacts 2 2 2 2 2 2 -
Reach Compliance Code unknown unknown unknown unknown unknown unknown -
Nominal circuit commutation break time 100 µs 100 µs 100 µs 100 µs 100 µs 100 µs -
Configuration SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE -
Critical rise rate of minimum off-state voltage 200 V/us 200 V/us 200 V/us 200 V/us 200 V/us 200 V/us -
Maximum DC gate trigger current 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA -
Maximum DC gate trigger voltage 3 V 3 V 3 V 3 V 3 V 3 V -
Maximum holding current 200 mA 200 mA 200 mA 200 mA 200 mA 200 mA -
JEDEC-95 code TO-208AC TO-208AC TO-208AC TO-208AC TO-208AC TO-208AC -
JESD-30 code O-MUPM-D2 O-MUPM-D2 O-MUPM-D2 O-MUPM-D2 O-MUPM-D2 O-MUPM-D2 -
JESD-609 code e0 e0 e0 e0 e0 e0 -
Number of components 1 1 1 1 1 1 -
Number of terminals 2 2 2 2 2 2 -
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C -
Minimum operating temperature -65 °C -65 °C -65 °C -65 °C -65 °C -65 °C -
Package body material METAL METAL METAL METAL METAL METAL -
Package shape ROUND ROUND ROUND ROUND ROUND ROUND -
Package form POST/STUD MOUNT POST/STUD MOUNT POST/STUD MOUNT POST/STUD MOUNT POST/STUD MOUNT POST/STUD MOUNT -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum rms on-state current 63 A 63 A 63 A 63 A 63 A 63 A -
Maximum repetitive peak off-state leakage current 6000 µA 6000 µA 6000 µA 6000 µA 6000 µA 6000 µA -
Off-state repetitive peak voltage 800 V 1200 V 400 V 1000 V 200 V 600 V -
Repeated peak reverse voltage 800 V 1200 V 400 V 1000 V 200 V 600 V -
surface mount NO NO NO NO NO NO -
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD -
Terminal form SOLDER LUG SOLDER LUG SOLDER LUG SOLDER LUG SOLDER LUG SOLDER LUG -
Terminal location UPPER UPPER UPPER UPPER UPPER UPPER -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Trigger device type SCR SCR SCR SCR SCR SCR -
Base Number Matches 1 1 1 1 1 1 -
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