25Amp Fast Recovery Full Wave Bridge Rectifier
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | conform to |
| Maker | Microsemi |
| package instruction | HERMETIC SEALED, GLASS PACAKGE-2 |
| Contacts | 2 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Shell connection | ISOLATED |
| Configuration | BRIDGE, 4 ELEMENTS |
| Diode component materials | SILICON |
| Diode type | BRIDGE RECTIFIER DIODE |
| Maximum forward voltage (VF) | 1.3 V |
| JESD-30 code | O-MUPF-D1 |
| JESD-609 code | e0 |
| Maximum non-repetitive peak forward current | 150 A |
| Number of components | 4 |
| Phase | 1 |
| Number of terminals | 1 |
| Maximum operating temperature | 175 °C |
| Maximum output current | 25 A |
| Package body material | METAL |
| Package shape | ROUND |
| Package form | PRESS FIT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum repetitive peak reverse voltage | 300 V |
| surface mount | NO |
| Terminal surface | TIN LEAD |
| Terminal form | SOLDER LUG |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| MY300X | MY100X_07 | MY100X | MY200X | MY400X | |
|---|---|---|---|---|---|
| Description | 25Amp Fast Recovery Full Wave Bridge Rectifier | 25Amp Fast Recovery Full Wave Bridge Rectifier | 25Amp Fast Recovery Full Wave Bridge Rectifier | 25Amp Fast Recovery Full Wave Bridge Rectifier | 25Amp Fast Recovery Full Wave Bridge Rectifier |
| Is it lead-free? | Contains lead | - | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | conform to | - | incompatible | conform to | conform to |
| Maker | Microsemi | - | - | Microsemi | Microsemi |
| package instruction | HERMETIC SEALED, GLASS PACAKGE-2 | - | O-MUPF-D1 | HERMETIC SEALED, GLASS PACAKGE-2 | HERMETIC SEALED, GLASS PACAKGE-2 |
| Contacts | 2 | - | 2 | 2 | 2 |
| Reach Compliance Code | unknow | - | compli | unknow | unknow |
| ECCN code | EAR99 | - | EAR99 | EAR99 | - |
| Shell connection | ISOLATED | - | ISOLATED | ISOLATED | ISOLATED |
| Configuration | BRIDGE, 4 ELEMENTS | - | BRIDGE, 4 ELEMENTS | BRIDGE, 4 ELEMENTS | BRIDGE, 4 ELEMENTS |
| Diode component materials | SILICON | - | SILICON | SILICON | SILICON |
| Diode type | BRIDGE RECTIFIER DIODE | - | BRIDGE RECTIFIER DIODE | BRIDGE RECTIFIER DIODE | BRIDGE RECTIFIER DIODE |
| Maximum forward voltage (VF) | 1.3 V | - | 1.3 V | 1.3 V | 1.3 V |
| JESD-30 code | O-MUPF-D1 | - | O-MUPF-D1 | O-MUPF-D1 | O-MUPF-D1 |
| JESD-609 code | e0 | - | e0 | e0 | e0 |
| Maximum non-repetitive peak forward current | 150 A | - | 150 A | 150 A | 150 A |
| Number of components | 4 | - | 4 | 4 | 4 |
| Phase | 1 | - | 1 | 1 | 1 |
| Number of terminals | 1 | - | 1 | 1 | 1 |
| Maximum operating temperature | 175 °C | - | 175 °C | 175 °C | 175 °C |
| Maximum output current | 25 A | - | 25 A | 25 A | 25 A |
| Package body material | METAL | - | METAL | METAL | METAL |
| Package shape | ROUND | - | ROUND | ROUND | ROUND |
| Package form | PRESS FIT | - | PRESS FIT | PRESS FIT | PRESS FIT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum repetitive peak reverse voltage | 300 V | - | 100 V | 200 V | 400 V |
| surface mount | NO | - | NO | NO | NO |
| Terminal surface | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | SOLDER LUG | - | SOLDER LUG | SOLDER LUG | SOLDER LUG |
| Terminal location | UPPER | - | UPPER | UPPER | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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