Standard SRAM, 16KX1, 125ns, CMOS, CDFP24,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Plessey Semiconductors Ltd. |
| package instruction | DFP, FL24,.4 |
| Reach Compliance Code | unknown |
| Maximum access time | 125 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-XDFP-F24 |
| JESD-609 code | e0 |
| memory density | 16384 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Number of terminals | 24 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 16KX1 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL24,.4 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum standby current | 0.0016 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.03 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| total dose | 100k Rad(Si) V |
| MAR9067FBBAF | MAR9067XBBAF | MAR9067XSBAF | MAR9067FSBAF | MAR9067CBBAF | |
|---|---|---|---|---|---|
| Description | Standard SRAM, 16KX1, 125ns, CMOS, CDFP24, | Standard SRAM, 16KX1, 125ns, CMOS, CDIP20, | Standard SRAM, 16KX1, 125ns, CMOS, CDIP20, | Standard SRAM, 16KX1, 125ns, CMOS, CDFP24, | Standard SRAM, 16KX1, 125ns, CMOS, CDIP24, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Plessey Semiconductors Ltd. | Plessey Semiconductors Ltd. | Plessey Semiconductors Ltd. | Plessey Semiconductors Ltd. | Plessey Semiconductors Ltd. |
| package instruction | DFP, FL24,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL24,.4 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 125 ns | 125 ns | 125 ns | 125 ns | 125 ns |
| I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 code | R-XDFP-F24 | R-XDIP-T20 | R-XDIP-T20 | R-XDFP-F24 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 20 | 20 | 24 | 24 |
| word count | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| character code | 16000 | 16000 | 16000 | 16000 | 16000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 16KX1 | 16KX1 | 16KX1 | 16KX1 | 16KX1 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DIP | DIP | DFP | DIP |
| Encapsulate equivalent code | FL24,.4 | DIP20,.3 | DIP20,.3 | FL24,.4 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535V;38534K;883S | 38535V;38534K;883S | 38535Q/M;38534H;883B |
| Maximum standby current | 0.0016 A | 0.0016 A | 0.0016 A | 0.0016 A | 0.0016 A |
| Minimum standby current | 2 V | 2 V | 2 V | 2 V | 2 V |
| Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| total dose | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |