|
ADS58C20IPFPR |
ADS58C20IPFP |
ADS58C23IPFP |
ADS58C23IPFPR |
| Description |
Dual Channel IF BTS Receiver with Signal Processing for multi-mode 3G+LTE+GSM 80-HTQFP -40 to 85 |
Dual Channel IF BTS Receiver with Signal Processing for multi-mode 3G+LTE+GSM 80-HTQFP -40 to 85 |
Dual Channel IF BTS Receiver with Signal Processing for multi-mode 3G+LTE 80-HTQFP -40 to 85 |
Dual Channel IF BTS Receiver with Signal Processing for multi-mode 3G+LTE 80-HTQFP -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| package instruction |
HTFQFP, QFP80,.55SQ,20 |
HTFQFP, QFP80,.55SQ,20 |
HTFQFP, QFP80,.55SQ,20 |
HTFQFP, QFP80,.55SQ,20 |
| Reach Compliance Code |
compli |
compli |
compli |
compli |
| Analog input maximum value |
3.45 V |
3.45 V |
3.45 V |
3.45 V |
| JESD-30 code |
S-PQFP-G80 |
S-PQFP-G80 |
S-PQFP-G80 |
S-PQFP-G80 |
| JESD-609 code |
e4 |
e4 |
e4 |
e4 |
| length |
12 mm |
12 mm |
12 mm |
12 mm |
| Humidity sensitivity level |
3 |
3 |
3 |
3 |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of terminals |
80 |
80 |
80 |
80 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
HTFQFP |
HTFQFP |
HTFQFP |
HTFQFP |
| Encapsulate equivalent code |
QFP80,.55SQ,20 |
QFP80,.55SQ,20 |
QFP80,.55SQ,20 |
QFP80,.55SQ,20 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
| Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
| surface mount |
YES |
YES |
YES |
YES |
| Telecom integrated circuit types |
RF AND BASEBAND CIRCUIT |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
RF AND BASEBAND CIRCUIT |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
| Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
12 mm |
12 mm |
12 mm |
12 mm |
| Factory Lead Time |
6 weeks |
6 weeks |
- |
6 weeks |