TC74HC11AF(EL,F) datasheet, PDF

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TC74HC11AF(EL,F): DescriptionIC,LOGIC GATE,3 3-INPUT AND,HC-CMOS,SOP,14PIN,PLASTIC; Categorylogic logic; File Size199KB，7 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/; Environmental Compliance

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TC74HC11AF(EL,F) Overview

IC,LOGIC GATE,3 3-INPUT AND,HC-CMOS,SOP,14PIN,PLASTIC

TC74HC11AF(EL,F) Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Toshiba Semiconductor
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G14
Load capacitance (CL)	50 pF
Logic integrated circuit type	AND GATE
MaximumI(ol)	0.004 A
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP14,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
method of packing	TAPE AND REEL
power supply	2/6 V
Prop。Delay @ Nom-Sup	21 ns
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL

TC74HC11AF(EL,F) Preview

TC74HC11AP/AF

TOSHIBA CMOS Digital Integrated Circuit

Silicon Monolithic

TC74HC11AP,TC74HC11AF

Triple 3-Input AND Gate

The TC74HC11A is a high speed CMOS 3-INPUT AND GATE

fabricated with silicon gate C

MOS technology.

It achieves the high speed operation similar to equivalent

LSTTL while maintaining the CMOS low power dissipation.

The internal circuit is composed of 4 stages including a buffer

output, which provide high noise immunity and stable output.

All inputs are equipped with protection circuits against static

discharge or transient excess voltage.

TC74HC11AP

Features

•

High speed: t

7 ns (typ.) at V

5 V

Low power dissipation: I

μA

(max) at Ta

25°C

High noise immunity: V

NIH

NIL

28% V

(min)

Output drive capability: 10 LSTTL loads

Symmetrical output impedance: |I

4 mA (min)

Balanced propagation delays: t

pLH

∼

pHL

−

Wide operating voltage range: V

(opr)

2 to 6 V

Pin and function compatible with 74LS11

Weight

DIP14-P-300-2.54

SOP14-P-300-1.27A

TC74HC11AF

Pin Assignment

: 0.96 g (typ.)

: 0.18 g (typ.)

IEC Logic Symbol

2012-02-29

TC74HC11AP/AF

Truth Table

X: Don’t care

Absolute Maximum Ratings (Note 1)

Characteristics

Supply voltage range

DC input voltage

DC output voltage

Input diode current

Output diode current

DC output current

DC V

/ground current

Power dissipation

Storage temperature

Symbol

OUT

stg

Rating

−0.5

to 7

−0.5

to V

0.5

−0.5

to V

0.5

±20

±25

±50

500 (DIP) (Note 2)/180 (SOP)

−65

to 150

Unit

°C

Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or

even destruction.

Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly

even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute

maximum ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 2: 500 mW in the range of Ta

= −40

to 65°C. From Ta

65 to 85°C a derating factor of

−10

mW/°C shall be

applied until 300 mW.

Operating Ranges (Note)

Characteristics

Supply voltage

Input voltage

Output voltage

Operating temperature

Symbol

OUT

opr

Rating

2 to 6

0 to V

−40

to 85

0 to 1000 (V

2.0 V)

Input rise and fall time

, t

0 to 500 (V

4.5 V)

0 to 400 (V

6.0 V)

Unit

°C

Note:

The operating ranges must be maintained to ensure the normal operation of the device.

Unused inputs must be tied to either VCC or GND.

2012-02-29

TC74HC11AP/AF

Electrical Characteristics

DC Characteristics

Characteristics

Symbol

Test Condition

(V)

2.0

High-level input

voltage

⎯

4.5

6.0

2.0

Low-level input

voltage

⎯

4.5

6.0

2.0

= −20 μA

High-level output

voltage

or V

= −4

= −5.2

μA

Low-level output

voltage

or V

4 mA

5.2 mA

Input leakage

current

Quiescent supply

current

or GND

4.5

6.0

4.5

6.0

2.0

4.5

6.0

4.5

6.0

Min

1.50

3.15

4.20

⎯

1.9

4.4

5.9

4.18

5.68

⎯

25°C

Typ.

⎯

2.0

4.5

6.0

4.31

5.80

0.0

0.17

0.18

⎯

Max

⎯

0.50

1.35

1.80

⎯

0.1

0.26

±0.1

1.0

−40

to 85°C

Min

1.50

3.15

4.20

⎯

1.9

4.4

5.9

4.13

5.63

⎯

Max

⎯

0.50

1.35

1.80

⎯

0.1

0.33

±1.0

10.0

μA

Unit

AC Characteristics

15 pF, V

5 V, Ta

25°C, input: t

6 ns)

Characteristics

Output transition time

Symbol

TLH

THL

pLH

pHL

Test Condition

⎯

Min

⎯

Typ.

Max

Unit

Propagation delay time

⎯

2012-02-29

TC74HC11AP/AF

AC Characteristics

50 pF, input: t

6 ns)

Characteristics

Symbol

Test Condition

(V)

TLH

THL

2.0

⎯

4.5

6.0

2.0

⎯

4.5

6.0

⎯

Min

⎯

25°C

Typ.

Max

⎯

−40

to 85°C

Min

⎯

Max

105

⎯

Unit

Output transition time

Propagation delay

time

Input capacitance

Power dissipation

capacitance

pLH

pHL

(Note)

Note:

is defined as the value of the internal equivalent capacitance which is calculated from the operating

current consumption without load.

Average operating current can be obtained by the equation:

(opr)

½V

½f

/3 (per gate)

2012-02-29

TC74HC11AP/AF

Package Dimensions

Weight: 0.96 g (typ.)

2012-02-29

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TC74HC11AF(EL,F) Related Products

	TC74HC11AF(EL,F)	TC74HC11AP(F)
Description	IC,LOGIC GATE,3 3-INPUT AND,HC-CMOS,SOP,14PIN,PLASTIC	IC HC/UH SERIES, TRIPLE 3-INPUT AND GATE, PDIP14, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-14, Gate
Is it Rohs certified?	conform to	conform to
Maker	Toshiba Semiconductor	Toshiba Semiconductor
Reach Compliance Code	unknown	unknown
JESD-30 code	R-PDSO-G14	R-PDIP-T14
Logic integrated circuit type	AND GATE	AND GATE
Number of terminals	14	14
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE
surface mount	YES	NO
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL

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