UVPROM, 8KX8, 120ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
| Parameter Name | Attribute value |
| Parts packaging code | DIP |
| package instruction | WDIP, |
| Contacts | 28 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 120 ns |
| JESD-30 code | R-GDIP-T28 |
| memory density | 65536 bi |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX8 |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.1 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | NMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| Base Number Matches | 1 |
| MSM2764A-12AS | MSM2764A-15AS | MSM2764A-25AS | MSM2764A-20AS | |
|---|---|---|---|---|
| Description | UVPROM, 8KX8, 120ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | UVPROM, 8KX8, 150ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | UVPROM, 8KX8, 25ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | UVPROM, 8KX8, 200ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 |
| Parts packaging code | DIP | DIP | DIP | DIP |
| package instruction | WDIP, | WDIP, | WDIP, | WDIP, |
| Contacts | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknow | unknow | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 120 ns | 150 ns | 25 ns | 200 ns |
| JESD-30 code | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 |
| memory density | 65536 bi | 65536 bi | 65536 bit | 65536 bit |
| Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP | WDIP | WDIP | WDIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.1 mm | 5.1 mm | 5.1 mm | 5.1 mm |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | NMOS | NMOS | NMOS | NMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |