Microprocessor, 8-Bit, 2.63MHz, NMOS, CDIP40, HERMETIC SEALED, CERDIP-40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| Address bus width | 16 |
| bit size | 8 |
| boundary scan | NO |
| maximum clock frequency | 2.63 MHz |
| External data bus width | 8 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-CDIP-T40 |
| JESD-609 code | e0 |
| length | 52.324 mm |
| low power mode | NO |
| Number of DMA channels | |
| Number of external interrupt devices | 1 |
| Number of serial I/Os | |
| Number of terminals | 40 |
| On-chip data RAM width | |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-5,12 V |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| Maximum seat height | 5.715 mm |
| speed | 2.63 MHz |
| Maximum slew rate | 50 mA |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | NMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
| AM9080A-2CC | AM9080A-4CC | AM9080A-4DC | AM9080A-1CC | AM9080ACC | AM9080A-2DM | AM9080ADM | AM9080A-4PC | |
|---|---|---|---|---|---|---|---|---|
| Description | Microprocessor, 8-Bit, 2.63MHz, NMOS, CDIP40, HERMETIC SEALED, CERDIP-40 | Microprocessor, 8-Bit, 4MHz, NMOS, CDIP40, HERMETIC SEALED, CERDIP-40 | Microprocessor, 16-Bit, 4MHz, NMOS, CDIP40, HERMETIC SEALED, CERDIP-40 | Microprocessor, 8-Bit, 3.125MHz, NMOS, CDIP40, HERMETIC SEALED, CERDIP-40 | Microprocessor, 8-Bit, 2.08MHz, NMOS, CDIP40, HERMETIC SEALED, CERDIP-40 | Microprocessor, 8-Bit, 2.63MHz, NMOS, CDIP40, HERMETIC SEALED, CERDIP-40 | Microprocessor, 8-Bit, 2.08MHz, NMOS, CDIP40, HERMETIC SEALED, CERDIP-40 | Microprocessor, 16-Bit, 4MHz, NMOS, PDIP40, PLASTIC, DIP-40 |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 |
| Contacts | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Address bus width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| bit size | 8 | 8 | 16 | 8 | 8 | 8 | 8 | 16 |
| boundary scan | NO | NO | NO | NO | NO | NO | NO | NO |
| maximum clock frequency | 2.63 MHz | 4 MHz | 4 MHz | 3.125 MHz | 2.08 MHz | 2.63 MHz | 2.08 MHz | 4 MHz |
| External data bus width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 code | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-PDIP-T40 |
| length | 52.324 mm | 52.324 mm | 52.324 mm | 52.324 mm | 52.324 mm | 52.324 mm | 52.324 mm | 52.451 mm |
| low power mode | NO | NO | NO | NO | NO | NO | NO | NO |
| Number of external interrupt devices | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.08 mm |
| speed | 2.63 MHz | 4 MHz | 4 MHz | 3.125 MHz | 2.08 MHz | 2.63 MHz | 2.08 MHz | 4 MHz |
| Maximum supply voltage | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V |
| Minimum supply voltage | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | - | AMD | AMD | AMD | AMD | AMD |
| JESD-609 code | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | - | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | +-5,12 V | +-5,12 V | +-5,12 V | - | +-5,12 V | +-5,12 V | +-5,12 V | +-5,12 V |
| Maximum slew rate | 50 mA | 50 mA | - | 50 mA | 50 mA | 60 mA | 60 mA | 50 mA |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
京公网安备 11010802033920号
EEWORLD
