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M5M5408AFP-10LL-I

Description
Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32
Categorystorage    storage   
File Size31KB,7 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
Download Datasheet Parametric Compare View All

M5M5408AFP-10LL-I Overview

Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32

M5M5408AFP-10LL-I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMitsubishi
Parts packaging codeSOIC
package instructionSOP, SOP32,.56
Contacts32
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time100 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G32
JESD-609 codee0
length20.75 mm
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP32,.56
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height3.05 mm
Maximum standby current0.00002 A
Minimum standby current2 V
Maximum slew rate0.09 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.4 mm
MITSUBISHI LSIs
M5M5408AFP,TP,RT-70L-I,-70LL-I,
-10L-I,-10LL-I
4194304-BIT (524288-WORD BY 8-BIT) CMOS STATIC RAM
DESCRIPTION
The M5M5408A is 4,194,304-bit CMOS static RAM organized as
524,288-words by 8-bit, fabricated using high-performance
quadruple-polysilicon and double metal CMOS technology.
The use of thin film transistor (TFT) load cells and CMOS periphery
results in a high density and low power static RAM.
The
M5M5408A is designed for memory applications where the high
performance, high reliability, large storage, simple interfacing and
battery back-up are important design objectives.
The M5M5408A is offered in a 32-pin plastic small outline
package (SOP) and a 32-pin thin small outline package (TSOP),
providing high board level packing densities. Two types of TSOP
packages are available, M5M5408ATP(normal lead bend type
package) and M5M5408ART (reverse lead bend type package).
Using both two types makes it easy to design a printed circuit
board.
PIN CONFIGURATION (TOP VIEW)
FEATURES
Type
Access
time
(max)
M5M5408AFP,TP,RT-70L-I
M5M5408AFP,TP,RT-10L-I
70ns
100ns
90mA
(Vcc=5.5V)
M5M5408AFP,TP,RT-70LL-I
M5M5408AFP,TP,RT-10LL-I
70ns
100ns
40µA
(Vcc=5.5v)
Power supply current
Active
(max)
Stand-by
(max)
200µA
(Vcc=5.5v)
A
18 1
A
16 2
A
14 3
A
12 4
A
7 5
A
6 6
A
5 7
A
4 8
A
3 9
A
2 10
A
1 11
A
0 12
DQ
1 13
DQ
2 14
DQ
3 15
(0V)
GND
16
V
CC
(5V)
31
A
15
30
A
17
29
W
28
A
13
27
A
8
26
A
9
25
A
11
24
OE
23
A
10
22
S
21
DQ
8
20
DQ
7
19
DQ
6
18
DQ
5
17
DQ
4
32
Outline 32P2M-A(FP)
32P3Y-H(TP)
M5M5408AFP,TP
-I
(5V)
V
CC
32
31
30
1
2
3
• Single +5V power supply
• No clocks, No refresh
• All inputs and outputs are TTL compatible.
• Easy memory expansion and power down by S
• Data retention supply voltage=+2.0V
• Three-state outputs: OR-tie capability
• OE prevents data contention in the I/O bus
• Common Data I/O
• Small stand-by current………………0.4µA(typ.)
• Package
M5M5408AFP : 32 pin 525 mil SOP
M5M5408ATP : 32 pin 400 mil TSOP(II)
M5M5408ART : 32 pin 400 mil TSOP(II)
A
15
A
17
W
A
13
A
8
A
9
A
11
OE
A
10
S
DQ
8
DQ
7
DQ
6
DQ
5
DQ
4
29
28
27
26
25
24
23
22
21
20
19
18
17
4
5
6
7
8
9
10
11
12
13
14
15
16
A
18
A
16
A
14
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
DQ
1
DQ
2
DQ
3
GND
(0V)
Outline 32P3Y-J(RT)
M5M5408ART
-I
APPLICATION
Small capacity memory units, IC card, Battery operating system,
asynchronous server system
MITSUBISHI
ELECTRIC
1

M5M5408AFP-10LL-I Related Products

M5M5408AFP-10LL-I M5M5408AFP-10L-I M5M5408ATP-10LL-I M5M5408ATP-10L-I M5M5408AFP-70LL-I M5M5408ART-10LL-I M5M5408AFP-70L-I M5M5408ART-70LL-I M5M5408ATP-70L-I
Description Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32 Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32 Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.400 INCH, REVERSE, TSOP2-32 Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 0.400 INCH, REVERSE, TSOP2-32 Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code SOIC SOIC TSOP2 TSOP2 SOIC TSOP2 SOIC TSOP2 TSOP2
package instruction SOP, SOP32,.56 SOP, SOP32,.56 TSOP2, TSOP32,.46 TSOP2, TSOP32,.46 SOP, SOP32,.56 TSOP2-R, TSOP32,.46 SOP, SOP32,.56 TSOP2-R, TSOP32,.46 TSOP2, TSOP32,.46
Contacts 32 32 32 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow unknow
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 100 ns 100 ns 100 ns 100 ns 70 ns 100 ns 70 ns 70 ns 70 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 20.75 mm 20.75 mm 20.95 mm 20.95 mm 20.75 mm 20.95 mm 20.75 mm 20.95 mm 20.95 mm
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bi 4194304 bi
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32 32
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP TSOP2 TSOP2 SOP TSOP2-R SOP TSOP2-R TSOP2
Encapsulate equivalent code SOP32,.56 SOP32,.56 TSOP32,.46 TSOP32,.46 SOP32,.56 TSOP32,.46 SOP32,.56 TSOP32,.46 TSOP32,.46
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.05 mm 3.05 mm 1.2 mm 1.2 mm 3.05 mm 1.2 mm 3.05 mm 1.2 mm 1.2 mm
Maximum standby current 0.00002 A 0.0001 A 0.00002 A 0.0001 A 0.00002 A 0.00002 A 0.0001 A 0.00002 A 0.0001 A
Minimum standby current 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V
Maximum slew rate 0.09 mA 0.09 mA 0.09 mA 0.09 mA 0.09 mA 0.09 mA 0.09 mA 0.09 mA 0.09 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11.4 mm 11.4 mm 10.16 mm 10.16 mm 11.4 mm 10.16 mm 11.4 mm 10.16 mm 10.16 mm
Maker Mitsubishi Mitsubishi - - Mitsubishi Mitsubishi Mitsubishi Mitsubishi Mitsubishi
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