74FCT374DCQR
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T20 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP |
| MaximumI(ol) | 0.048 A |
| Number of functions | 8 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 10 ns |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Trigger type | POSITIVE EDGE |
| 74FCT374DCQR | 54FCT374LMQR | 54FCT374DMQR | 54FCT374FMQR | 74FCT374ADCQR | 54FCT374ADMQR | 54FCT374AFMQR | 54FCT374ALMQR | |
|---|---|---|---|---|---|---|---|---|
| Description | 74FCT374DCQR | IC,FLIP-FLOP,OCTAL,D TYPE,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,FCT/PCT-CMOS,DIP,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,FCT/PCT-CMOS,FP,20PIN,CERAMIC | 74FCT374ADCQR | 54FCT374ADMQR | 54FCT374AFMQR | 54FCT374ALMQR |
| package instruction | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T20 | S-XQCC-N20 | R-XDIP-T20 | R-XDFP-F20 | R-XDIP-T20 | R-XDIP-T20 | R-XDFP-F20 | S-XQCC-N20 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| MaximumI(ol) | 0.048 A | 0.032 A | 0.032 A | 0.032 A | 0.048 A | 0.032 A | 0.032 A | 0.032 A |
| Number of functions | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | QCCN | DIP | DFP | DIP | DIP | DFP | QCCN |
| Encapsulate equivalent code | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | FL20,.3 | DIP20,.3 | DIP20,.3 | FL20,.3 | LCC20,.35SQ |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES | NO | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Is it Rohs certified? | incompatible | - | - | - | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | - | - | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| JESD-609 code | e0 | - | - | - | e0 | e0 | e0 | e0 |
| Prop。Delay @ Nom-Sup | 10 ns | 11 ns | 11 ns | 11 ns | 6.5 ns | - | - | - |
| Terminal surface | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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