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54FCT374ALMQR

Description
54FCT374ALMQR
Categorylogic   
File Size395KB,8 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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54FCT374ALMQR Overview

54FCT374ALMQR

54FCT374ALMQR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionQCCN, LCC20,.35SQ
Reach Compliance Codeunknown
Is SamacsysN
JESD-30 codeS-XQCC-N20
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeD FLIP-FLOP
MaximumI(ol)0.032 A
Number of functions8
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeQCCN
Encapsulate equivalent codeLCC20,.35SQ
Package shapeSQUARE
Package formCHIP CARRIER
power supply5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Trigger typePOSITIVE EDGE
Base Number Matches1

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Description 54FCT374ALMQR IC,FLIP-FLOP,OCTAL,D TYPE,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC IC,FLIP-FLOP,OCTAL,D TYPE,FCT/PCT-CMOS,DIP,20PIN,CERAMIC IC,FLIP-FLOP,OCTAL,D TYPE,FCT/PCT-CMOS,FP,20PIN,CERAMIC 74FCT374ADCQR 54FCT374ADMQR 54FCT374AFMQR 74FCT374DCQR
package instruction QCCN, LCC20,.35SQ QCCN, LCC20,.35SQ DIP, DIP20,.3 DFP, FL20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DFP, FL20,.3 DIP, DIP20,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code S-XQCC-N20 S-XQCC-N20 R-XDIP-T20 R-XDFP-F20 R-XDIP-T20 R-XDIP-T20 R-XDFP-F20 R-XDIP-T20
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
MaximumI(ol) 0.032 A 0.032 A 0.032 A 0.032 A 0.048 A 0.032 A 0.032 A 0.048 A
Number of functions 8 8 8 8 8 8 8 8
Number of terminals 20 20 20 20 20 20 20 20
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 70 °C 125 °C 125 °C 70 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C - -55 °C -55 °C -
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code QCCN QCCN DIP DFP DIP DIP DFP DIP
Encapsulate equivalent code LCC20,.35SQ LCC20,.35SQ DIP20,.3 FL20,.3 DIP20,.3 DIP20,.3 FL20,.3 DIP20,.3
Package shape SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER IN-LINE FLATPACK IN-LINE IN-LINE FLATPACK IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO YES NO NO YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY COMMERCIAL MILITARY MILITARY COMMERCIAL
Terminal form NO LEAD NO LEAD THROUGH-HOLE FLAT THROUGH-HOLE THROUGH-HOLE FLAT THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location QUAD QUAD DUAL DUAL DUAL DUAL DUAL DUAL
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
Is it Rohs certified? incompatible - - - incompatible incompatible incompatible incompatible
Maker Texas Instruments - - - Texas Instruments Texas Instruments Texas Instruments Texas Instruments
JESD-609 code e0 - - - e0 e0 e0 e0
Terminal surface Tin/Lead (Sn/Pb) - - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Base Number Matches 1 1 1 1 1 1 1 -
Prop。Delay @ Nom-Sup - 11 ns 11 ns 11 ns 6.5 ns - - 10 ns
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