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54FCT374DMQR

Description
IC,FLIP-FLOP,OCTAL,D TYPE,FCT/PCT-CMOS,DIP,20PIN,CERAMIC
Categorylogic    logic   
File Size395KB,8 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

54FCT374DMQR Overview

IC,FLIP-FLOP,OCTAL,D TYPE,FCT/PCT-CMOS,DIP,20PIN,CERAMIC

54FCT374DMQR Parametric

Parameter NameAttribute value
package instructionDIP, DIP20,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T20
Load capacitance (CL)50 pF
Logic integrated circuit typeD FLIP-FLOP
MaximumI(ol)0.032 A
Number of functions8
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Prop。Delay @ Nom-Sup11 ns
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Trigger typePOSITIVE EDGE
Base Number Matches1

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54FCT374DMQR 54FCT374LMQR 54FCT374FMQR 74FCT374ADCQR 54FCT374ADMQR 54FCT374AFMQR 54FCT374ALMQR 74FCT374DCQR
Description IC,FLIP-FLOP,OCTAL,D TYPE,FCT/PCT-CMOS,DIP,20PIN,CERAMIC IC,FLIP-FLOP,OCTAL,D TYPE,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC IC,FLIP-FLOP,OCTAL,D TYPE,FCT/PCT-CMOS,FP,20PIN,CERAMIC 74FCT374ADCQR 54FCT374ADMQR 54FCT374AFMQR 54FCT374ALMQR 74FCT374DCQR
package instruction DIP, DIP20,.3 QCCN, LCC20,.35SQ DFP, FL20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DFP, FL20,.3 QCCN, LCC20,.35SQ DIP, DIP20,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T20 S-XQCC-N20 R-XDFP-F20 R-XDIP-T20 R-XDIP-T20 R-XDFP-F20 S-XQCC-N20 R-XDIP-T20
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
MaximumI(ol) 0.032 A 0.032 A 0.032 A 0.048 A 0.032 A 0.032 A 0.032 A 0.048 A
Number of functions 8 8 8 8 8 8 8 8
Number of terminals 20 20 20 20 20 20 20 20
Maximum operating temperature 125 °C 125 °C 125 °C 70 °C 125 °C 125 °C 125 °C 70 °C
Minimum operating temperature -55 °C -55 °C -55 °C - -55 °C -55 °C -55 °C -
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP QCCN DFP DIP DIP DFP QCCN DIP
Encapsulate equivalent code DIP20,.3 LCC20,.35SQ FL20,.3 DIP20,.3 DIP20,.3 FL20,.3 LCC20,.35SQ DIP20,.3
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form IN-LINE CHIP CARRIER FLATPACK IN-LINE IN-LINE FLATPACK CHIP CARRIER IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES NO NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY COMMERCIAL MILITARY MILITARY MILITARY COMMERCIAL
Terminal form THROUGH-HOLE NO LEAD FLAT THROUGH-HOLE THROUGH-HOLE FLAT NO LEAD THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL QUAD DUAL DUAL DUAL DUAL QUAD DUAL
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
Prop。Delay @ Nom-Sup 11 ns 11 ns 11 ns 6.5 ns - - - 10 ns
Base Number Matches 1 1 1 1 1 1 1 -
Is it Rohs certified? - - - incompatible incompatible incompatible incompatible incompatible
Maker - - - Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
JESD-609 code - - - e0 e0 e0 e0 e0
Terminal surface - - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
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