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IDT7MC156S55CS

Description
SRAM Module, 256KX1, 55ns, CMOS
Categorystorage    storage   
File Size146KB,6 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT7MC156S55CS Overview

SRAM Module, 256KX1, 55ns, CMOS

IDT7MC156S55CS Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time55 ns
I/O typeSEPARATE
JESD-30 codeR-XSMA-T28
JESD-609 codee0
memory density262144 bit
Memory IC TypeSRAM MODULE
memory width1
Number of functions1
Number of terminals28
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX1
Output characteristics3-STATE
Package body materialUNSPECIFIED
Encapsulate equivalent codeSIP28,.1
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum standby current0.08 A
Minimum standby current4.5 V
Maximum slew rate0.33 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED

IDT7MC156S55CS Related Products

IDT7MC156S55CS IDT7MC156S35CS IDT7MC156S25CS IDT7MC156S30CS IDT7MC156S45CS
Description SRAM Module, 256KX1, 55ns, CMOS SRAM Module, 256KX1, 35ns, CMOS SRAM Module, 256KX1, 25ns, CMOS SRAM Module, 256KX1, 30ns, CMOS SRAM Module, 256KX1, 45ns, CMOS
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 55 ns 35 ns 25 ns 30 ns 45 ns
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-XSMA-T28 R-XSMA-T28 R-XSMA-T28 R-XSMA-T28 R-XSMA-T28
JESD-609 code e0 e0 e0 e0 e0
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 1 1 1 1 1
Number of functions 1 1 1 1 1
Number of terminals 28 28 28 28 28
word count 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX1 256KX1 256KX1 256KX1 256KX1
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Encapsulate equivalent code SIP28,.1 SIP28,.1 SIP28,.1 SIP28,.1 SIP28,.1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.08 A 0.08 A 0.08 A 0.08 A 0.08 A
Minimum standby current 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Maximum slew rate 0.33 mA 0.33 mA 0.33 mA 0.33 mA 0.33 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location SINGLE SINGLE SINGLE SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maker IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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