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PC28F256J3F95A

Description
Flash, 16MX16, 95ns, PBGA64, LEAD FREE, BGA-64
Categorystorage    storage   
File Size671KB,66 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance  
Download Datasheet Parametric Compare View All

PC28F256J3F95A Overview

Flash, 16MX16, 95ns, PBGA64, LEAD FREE, BGA-64

PC28F256J3F95A Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicron Technology
Parts packaging codeBGA
package instructionTBGA,
Contacts64
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time95 ns
Spare memory width8
JESD-30 codeR-PBGA-B64
JESD-609 codee1
length13 mm
memory density268435456 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals64
word count16777216 words
character code16000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize16MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
typeNOR TYPE
width10 mm
Numonyx™ StrataFlash
®
Embedded Memory
(J3-65nm)
256-Mbit
Datasheet
Product Features
Architecture
— Multi-Level Cell Technology: Highest
Density at Lowest Cost
— 256 symmetrically-sized blocks of 128
Kbytes
Performance
— 95 ns initial access time for Easy BGA
— 105 ns initial accsss time for TSOP
— 25 ns 16-word Asynchronous page-mode
reads
— 512-Word Buffer Programming at
1.46MByte/s (Typ)
Voltage and Power
— V
CC
(Core) = 2.7 V to 3.6 V
— V
CCQ
(I/O) = 2.7 V to 3.6 V
— Standby Current: 65 µA (Typ)
— Erase & Program Current: 35 mA (Typ)
— Page Read: 12 mA (Typ)
Quality and Reliability
— Operating temperature:
-40 °C to +85 °C
— 100K Minimum erase cycles per block
— 65 nm Numonyx
TM
ETOX™ X Process
technology
Security
— Enhanced security options for code
protection
— Absolute protection with V
PEN
= GND
— Individual block locking
— Block erase/program lockout during power
transition
— Password Access feature
— One-Time Programmable Register:
64 OTP bits, programmed with unique
information by Numonyx
64 OTP bits, available for customer
programming
Software
— 20 µs (Typ) program suspend
— 20 µs (Typ) erase suspend
— Numonyx™ Flash Data Integrator (FDI)
— Common Flash Interface (CFI) Compatible
Packaging
— 56-Lead TSOP
— 64-Ball Easy BGA package
319942-02
December 2008

PC28F256J3F95A Related Products

PC28F256J3F95A JS28F256J3F105A RC28F256J3F95A TE28F256J3F105A
Description Flash, 16MX16, 95ns, PBGA64, LEAD FREE, BGA-64 Flash, 16MX16, 105ns, PDSO56, 14 X 20 MM, LEAD FREE, TSOP-56 Flash, 16MX16, 95ns, PBGA64, BGA-64 Flash, 16MX16, 105ns, PDSO56, 14 X 20 MM, TSOP-56
Is it Rohs certified? conform to conform to incompatible incompatible
Maker Micron Technology Micron Technology Micron Technology Micron Technology
Parts packaging code BGA TSOP BGA TSOP
package instruction TBGA, TSSOP, BGA-64 14 X 20 MM, TSOP-56
Contacts 64 56 64 56
Reach Compliance Code compliant compliant compliant unknown
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 95 ns 105 ns 95 ns 105 ns
Spare memory width 8 8 8 8
JESD-30 code R-PBGA-B64 R-PDSO-G56 R-PBGA-B64 R-PDSO-G56
JESD-609 code e1 e3 e0 e0
length 13 mm 18.4 mm 13 mm 18.4 mm
memory density 268435456 bit 268435456 bit 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH FLASH FLASH
memory width 16 16 16 16
Number of functions 1 1 1 1
Number of terminals 64 56 64 56
word count 16777216 words 16777216 words 16777216 words 16777216 words
character code 16000000 16000000 16000000 16000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 16MX16 16MX16 16MX16 16MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TBGA TSSOP TBGA TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY SMALL OUTLINE GRID ARRAY SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 235 235
Programming voltage 2.7 V 2.7 V 2.7 V 2.7 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) TIN LEAD SILVER TIN LEAD
Terminal form BALL GULL WING BALL GULL WING
Terminal pitch 1 mm 0.5 mm 1 mm 0.5 mm
Terminal location BOTTOM DUAL BOTTOM DUAL
Maximum time at peak reflow temperature 30 30 30 30
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 10 mm 14 mm 10 mm 14 mm
Is it lead-free? Lead free Lead free Contains lead -
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