MC74HC4078ND datasheet, PDF - EEWORLD Datasheet

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MC74HC4078ND: DescriptionIC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,DIP,14PIN,PLASTIC; Categorylogic logic; File Size241KB，4 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC74HC4078ND Overview

IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,DIP,14PIN,PLASTIC

MC74HC4078ND Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T14
JESD-609 code	e0
Logic integrated circuit type	OR/NOR GATE
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Schmitt trigger	NO
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MC74HC4078ND Related Products

	MC74HC4078ND	MC74HC4078DD	MC54HC4078JD	MC74HC4078DR2	MC54HC4078JDS
Description	IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,DIP,14PIN,PLASTIC	IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,SOP,14PIN,PLASTIC	IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,SOP,14PIN,PLASTIC	IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,DIP,14PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP
package instruction	DIP, DIP14,.3	SOP, SOP14,.25	DIP, DIP14,.3	SOP, SOP14,.25	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T14	R-PDSO-G14	R-XDIP-T14	R-PDSO-G14	R-XDIP-T14
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	OR/NOR GATE	OR/NOR GATE	OR/NOR GATE	OR/NOR GATE	OR/NOR GATE
Number of terminals	14	14	14	14	14
Maximum operating temperature	85 °C	85 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-55 °C	-55 °C	-55 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	SOP	DIP	SOP	DIP
Encapsulate equivalent code	DIP14,.3	SOP14,.25	DIP14,.3	SOP14,.25	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V
Schmitt trigger	NO	NO	NO	NO	NO
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL

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