IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,DIP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | OR/NOR GATE |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Schmitt trigger | NO |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| MC54HC4078JD | MC74HC4078DD | MC74HC4078ND | MC74HC4078DR2 | MC54HC4078JDS | |
|---|---|---|---|---|---|
| Description | IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,DIP,14PIN,CERAMIC | IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,DIP,14PIN,PLASTIC | IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,8-INPUT OR/NOR,HC-CMOS,DIP,14PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP | NXP | NXP |
| package instruction | DIP, DIP14,.3 | SOP, SOP14,.25 | DIP, DIP14,.3 | SOP, SOP14,.25 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-XDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | OR/NOR GATE | OR/NOR GATE | OR/NOR GATE | OR/NOR GATE | OR/NOR GATE |
| Number of terminals | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | SOP | DIP | SOP | DIP |
| Encapsulate equivalent code | DIP14,.3 | SOP14,.25 | DIP14,.3 | SOP14,.25 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Schmitt trigger | NO | NO | NO | NO | NO |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
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