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M27C1001-45C1F

Description
128KX8 OTPROM, 45ns, PQCC32, ROHS COMPLIANT, PLASTIC, LCC-32
Categorystorage    storage   
File Size226KB,24 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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M27C1001-45C1F Overview

128KX8 OTPROM, 45ns, PQCC32, ROHS COMPLIANT, PLASTIC, LCC-32

M27C1001-45C1F Parametric

Parameter NameAttribute value
MakerSTMicroelectronics
Parts packaging codeQFJ
package instructionQCCJ,
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time45 ns
Other features00.1.142
JESD-30 codeR-PQCC-J32
length13.97 mm
memory density1048576 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height3.56 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width11.43 mm
M27C1001
1 Mbit (128 Kbit x 8) UV EPROM and OTP EPROM
Features
5v ± 10% Supply Voltage in Read Operation
Access Time: 35ns
32
32
Low Power Consumption:
– Active Current: 30 mA at 5 MHz
– Standby Current: 100 µA
Programming Voltage: 12.75V ± 0.25V
Programming Time: 100 µs/word
Electronic Signature
– Manufacturer Code: 20h
– Device Code: 05h
ECOPACK® packages available
1
1
FDIP32W (F)
PDIP32 (B)
PLCC32 (C)
TSOP32 (N)
8 x 20 mm
April 2006
Rev 5
1/24
www.st.com
1

M27C1001-45C1F Related Products

M27C1001-45C1F M27C1001-60XF1 M27C1001-70XF1 M27C1001-20F1 M27C1001-70N1 M27C1001-45XN1 M27C1001-15F1E M27C1001-45C1E M27C1001-90C6E
Description 128KX8 OTPROM, 45ns, PQCC32, ROHS COMPLIANT, PLASTIC, LCC-32 eprom RO 511-m27c1001-45xf dip-32 128kx8 60ns eprom RO 511-m27c1001-45xf dip-32 128kx8 70ns eprom RO 511-m27c1001-15f dip-28 128kx8 200ns eprom 1M (128kx8) 70ns eprom 1M (128kx8) 45ns 128KX8 UVPROM, 150ns, CDIP32, ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 128KX8 OTPROM, 45ns, PQCC32, ROHS COMPLIANT, PLASTIC, LCC-32 128KX8 OTPROM, 90ns, PQCC32, ROHS COMPLIANT, PLASTIC, LCC-32
Maker STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code QFJ DIP DIP DIP TSOP TSOP DIP QFJ QFJ
package instruction QCCJ, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32 8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32 DIP, QCCJ, ROHS COMPLIANT, PLASTIC, LCC-32
Contacts 32 32 32 32 32 32 32 32 32
Reach Compliance Code unknown compliant unknown compliant unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 45 ns 60 ns 70 ns 200 ns 70 ns 45 ns 150 ns 45 ns 90 ns
Other features 00.1.142 00.1.142 00.1.142 00.1.142 00.1.142 00.1.142 00.1.142 00.1.142 00.1.142
JESD-30 code R-PQCC-J32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-PDSO-G32 R-PDSO-G32 R-CDIP-T32 R-PQCC-J32 R-PQCC-J32
length 13.97 mm 41.885 mm 41.885 mm 41.885 mm 18.4 mm 18.4 mm 41.885 mm 13.97 mm 13.97 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type OTP ROM UVPROM UVPROM UVPROM OTP ROM OTP ROM UVPROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 85 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Package body material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ WDIP WDIP WDIP TSOP1 TSOP1 DIP QCCJ QCCJ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE IN-LINE CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.56 mm 5.72 mm 5.72 mm 5.72 mm 1.2 mm 1.2 mm 5.72 mm 3.56 mm 3.56 mm
Maximum supply voltage (Vsup) 5.5 V 5.25 V 5.25 V 5.5 V 5.5 V 5.25 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.75 V 4.75 V 4.5 V 4.5 V 4.75 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO NO YES YES NO YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal form J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE J BEND J BEND
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm 0.5 mm 0.5 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location QUAD DUAL DUAL DUAL DUAL DUAL DUAL QUAD QUAD
width 11.43 mm 15.24 mm 15.24 mm 15.24 mm 8 mm 8 mm 15.24 mm 11.43 mm 11.43 mm
Is it Rohs certified? - conform to conform to conform to conform to conform to - - -
I/O type - COMMON COMMON COMMON COMMON COMMON - - -
JESD-609 code - e3 e3 e3 e3/e6 e3/e6 - - -
Output characteristics - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE - - -
Encapsulate equivalent code - DIP32,.6 DIP32,.6 DIP32,.6 TSSOP32,.8,20 TSSOP32,.8,20 - - -
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 260 - - -
power supply - 5 V 5 V 5 V 5 V 5 V - - -
Maximum standby current - 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A - - -
Maximum slew rate - 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA - - -
Terminal surface - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) TIN/TIN BISMUTH TIN/TIN BISMUTH - - -
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - - -

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