M27C1001-60XF1 datasheet, PDF - EEWORLD Datasheet

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M27C1001-60XF1: Descriptioneprom RO 511-m27c1001-45xf dip-32 128kx8 60ns; Categorystorage storage; File Size226KB，24 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M27C1001-60XF1 Overview

eprom RO 511-m27c1001-45xf dip-32 128kx8 60ns

M27C1001-60XF1 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32
Contacts	32
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	60 ns
Other features	00.1.142
I/O type	COMMON
JESD-30 code	R-CDIP-T32
JESD-609 code	e3
length	41.885 mm
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WDIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.72 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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M27C1001

1 Mbit (128 Kbit x 8) UV EPROM and OTP EPROM

Features

■

5v ± 10% Supply Voltage in Read Operation

Access Time: 35ns

Low Power Consumption:

– Active Current: 30 mA at 5 MHz

– Standby Current: 100 µA

Programming Voltage: 12.75V ± 0.25V

Programming Time: 100 µs/word

Electronic Signature

– Manufacturer Code: 20h

– Device Code: 05h

ECOPACK® packages available

FDIP32W (F)

PDIP32 (B)

■

PLCC32 (C)

■

TSOP32 (N)

8 x 20 mm

April 2006

Rev 5

1/24

www.st.com

Contents

M27C1001

Contents

Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

2.10

Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Presto II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11

Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.1

5.2

5.3

5.4

32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA) . . . . . . . . 18

32-pin Plastic DIP, 600 mils width (PDIP32) . . . . . . . . . . . . . . . . . . . . . . . 19

32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32) . . . . . . . . . . 20

32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32) . . . . . . . . . . . . . 21

Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

2/24

M27C1001

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

FDIP32WA package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

PDIP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

PLCC32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

TSOP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3/24

M27C1001-60XF1 Related Products

	M27C1001-60XF1	M27C1001-70XF1	M27C1001-20F1	M27C1001-70N1	M27C1001-45XN1	M27C1001-15F1E	M27C1001-45C1E	M27C1001-45C1F	M27C1001-90C6E
Description	eprom RO 511-m27c1001-45xf dip-32 128kx8 60ns	eprom RO 511-m27c1001-45xf dip-32 128kx8 70ns	eprom RO 511-m27c1001-15f dip-28 128kx8 200ns	eprom 1M (128kx8) 70ns	eprom 1M (128kx8) 45ns	128KX8 UVPROM, 150ns, CDIP32, ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-32	128KX8 OTPROM, 45ns, PQCC32, ROHS COMPLIANT, PLASTIC, LCC-32	128KX8 OTPROM, 45ns, PQCC32, ROHS COMPLIANT, PLASTIC, LCC-32	128KX8 OTPROM, 90ns, PQCC32, ROHS COMPLIANT, PLASTIC, LCC-32
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	DIP	DIP	DIP	TSOP	TSOP	DIP	QFJ	QFJ	QFJ
package instruction	LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32	LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32	LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32	8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32	8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32	DIP,	QCCJ,	QCCJ,	ROHS COMPLIANT, PLASTIC, LCC-32
Contacts	32	32	32	32	32	32	32	32	32
Reach Compliance Code	compliant	unknown	compliant	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	60 ns	70 ns	200 ns	70 ns	45 ns	150 ns	45 ns	45 ns	90 ns
Other features	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142
JESD-30 code	R-CDIP-T32	R-CDIP-T32	R-CDIP-T32	R-PDSO-G32	R-PDSO-G32	R-CDIP-T32	R-PQCC-J32	R-PQCC-J32	R-PQCC-J32
length	41.885 mm	41.885 mm	41.885 mm	18.4 mm	18.4 mm	41.885 mm	13.97 mm	13.97 mm	13.97 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	OTP ROM	OTP ROM	UVPROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	85 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	WDIP	WDIP	WDIP	TSOP1	TSOP1	DIP	QCCJ	QCCJ	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.72 mm	5.72 mm	5.72 mm	1.2 mm	1.2 mm	5.72 mm	3.56 mm	3.56 mm	3.56 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.5 V	5.5 V	5.25 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.5 V	4.5 V	4.75 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	J BEND	J BEND	J BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	0.5 mm	0.5 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD
width	15.24 mm	15.24 mm	15.24 mm	8 mm	8 mm	15.24 mm	11.43 mm	11.43 mm	11.43 mm
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	-	-	-	-
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	-	-	-	-
JESD-609 code	e3	e3	e3	e3/e6	e3/e6	-	-	-	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-	-	-	-
Encapsulate equivalent code	DIP32,.6	DIP32,.6	DIP32,.6	TSSOP32,.8,20	TSSOP32,.8,20	-	-	-	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260	-	-	-	-
power supply	5 V	5 V	5 V	5 V	5 V	-	-	-	-
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	-	-	-	-
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	-	-	-	-
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	TIN/TIN BISMUTH	TIN/TIN BISMUTH	-	-	-	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	-	-

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