M27C1001-45XN1 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> M27C1001-45XN1

M27C1001-45XN1: Descriptioneprom 1M (128kx8) 45ns; Categorystorage storage; File Size226KB，24 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

Download Datasheet Parametric Compare View All

M27C1001-45XN1 Overview

eprom 1M (128kx8) 45ns

M27C1001-45XN1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	TSOP
package instruction	8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	45 ns
Other features	00.1.142
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e3/e6
length	18.4 mm
memory density	1048576 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP32,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN/TIN BISMUTH
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

Preview

Download Datasheet

View All

M27C1001

1 Mbit (128 Kbit x 8) UV EPROM and OTP EPROM

Features

■

5v ± 10% Supply Voltage in Read Operation

Access Time: 35ns

Low Power Consumption:

– Active Current: 30 mA at 5 MHz

– Standby Current: 100 µA

Programming Voltage: 12.75V ± 0.25V

Programming Time: 100 µs/word

Electronic Signature

– Manufacturer Code: 20h

– Device Code: 05h

ECOPACK® packages available

FDIP32W (F)

PDIP32 (B)

■

PLCC32 (C)

■

TSOP32 (N)

8 x 20 mm

April 2006

Rev 5

1/24

www.st.com

Contents

M27C1001

Contents

Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

2.10

Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Presto II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11

Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.1

5.2

5.3

5.4

32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA) . . . . . . . . 18

32-pin Plastic DIP, 600 mils width (PDIP32) . . . . . . . . . . . . . . . . . . . . . . . 19

32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32) . . . . . . . . . . 20

32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32) . . . . . . . . . . . . . 21

Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

2/24

M27C1001

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

FDIP32WA package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

PDIP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

PLCC32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

TSOP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3/24

M27C1001-45XN1 Related Products

	M27C1001-45XN1	M27C1001-60XF1	M27C1001-70XF1	M27C1001-20F1	M27C1001-70N1	M27C1001-15F1E	M27C1001-45C1E	M27C1001-45C1F	M27C1001-90C6E
Description	eprom 1M (128kx8) 45ns	eprom RO 511-m27c1001-45xf dip-32 128kx8 60ns	eprom RO 511-m27c1001-45xf dip-32 128kx8 70ns	eprom RO 511-m27c1001-15f dip-28 128kx8 200ns	eprom 1M (128kx8) 70ns	128KX8 UVPROM, 150ns, CDIP32, ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-32	128KX8 OTPROM, 45ns, PQCC32, ROHS COMPLIANT, PLASTIC, LCC-32	128KX8 OTPROM, 45ns, PQCC32, ROHS COMPLIANT, PLASTIC, LCC-32	128KX8 OTPROM, 90ns, PQCC32, ROHS COMPLIANT, PLASTIC, LCC-32
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	TSOP	DIP	DIP	DIP	TSOP	DIP	QFJ	QFJ	QFJ
package instruction	8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32	LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32	LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32	LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32	8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32	DIP,	QCCJ,	QCCJ,	ROHS COMPLIANT, PLASTIC, LCC-32
Contacts	32	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	compliant	unknown	compliant	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	45 ns	60 ns	70 ns	200 ns	70 ns	150 ns	45 ns	45 ns	90 ns
Other features	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142
JESD-30 code	R-PDSO-G32	R-CDIP-T32	R-CDIP-T32	R-CDIP-T32	R-PDSO-G32	R-CDIP-T32	R-PQCC-J32	R-PQCC-J32	R-PQCC-J32
length	18.4 mm	41.885 mm	41.885 mm	41.885 mm	18.4 mm	41.885 mm	13.97 mm	13.97 mm	13.97 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	OTP ROM	UVPROM	UVPROM	UVPROM	OTP ROM	UVPROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	85 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	WDIP	WDIP	WDIP	TSOP1	DIP	QCCJ	QCCJ	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	SMALL OUTLINE, THIN PROFILE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	5.72 mm	5.72 mm	5.72 mm	1.2 mm	5.72 mm	3.56 mm	3.56 mm	3.56 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	YES	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	J BEND	J BEND	J BEND
Terminal pitch	0.5 mm	2.54 mm	2.54 mm	2.54 mm	0.5 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD
width	8 mm	15.24 mm	15.24 mm	15.24 mm	8 mm	15.24 mm	11.43 mm	11.43 mm	11.43 mm
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	-	-	-	-
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	-	-	-	-
JESD-609 code	e3/e6	e3	e3	e3	e3/e6	-	-	-	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-	-	-	-
Encapsulate equivalent code	TSSOP32,.8,20	DIP32,.6	DIP32,.6	DIP32,.6	TSSOP32,.8,20	-	-	-	-
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	-	-
power supply	5 V	5 V	5 V	5 V	5 V	-	-	-	-
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	-	-	-	-
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	-	-	-	-
Terminal surface	TIN/TIN BISMUTH	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	TIN/TIN BISMUTH	-	-	-	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	-	-

Recommended Resources

Computer host automatic temperature control circuit

One control and one fan frequency conversion speed control circuit 2b

Thermistor temperature data acquisition circuit

duty cycle modulator

Audio Notch Filter

12V collector output regulated power supply circuit three

Urgent help, the s3c2440 development board keeps running away?: I made a 2440 board myself, with two SAMSUNG K4S511632D-UC75 64M SDRAM. Now it always crashes at the BOOTLOADER stage, either freezing during the countdown or crashing while reading the FLASH. I teste...; yunalps Embedded System

LVDS Converter IC: Professional agent provides LVDS conversion chip: LVDS TO TTL: 18bit, 24bit, 30bit TTL TO LVDS: 18bit, 24bit, 30bit LVDS/TTL to RSDS If you need it, please send an email to my email: iven.yang@163.com...; c51rf2 Embedded System

Is it possible to use CW single-step debugging to see the execution of the interrupt program?: I wrote an SCI receive interrupt and used CW single-step debugging, but there is a problem. After the interrupt is entered, there is a step to determine the receive status register. The value of this ...; socsic NXP MCU

Who has English journals about STM32?: After graduation, the school required me to have English literature, but I couldn't find any on the Internet....; ilovemcu stm32/stm8

About ZB500 cc2530 zigbee module: I want to use this board to implement the simpleapp program in the protocol stack, but my board only has two buttons, key1 and key2. How can I bind the coordinator and the terminal? How can I implemen...; wanlwh123 RF/Wirelessly

Fujitsu FRAM Experience Submission - Fast Words Dominate: As a compact, standardized memory chip, MB85RC256V has unlimited potential in the field of embedded mobile control. Our products are used in this field. Through this trial, we have realized the advant...; gongfeionline Integrated technical exchanges

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components