EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQCC68, SMD-68
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | APTA Group Inc |
| package instruction | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown |
| Maximum access time | 150 ns |
| Other features | IT ALSO CONFIGURED AS 512K X 8 |
| Spare memory width | 16 |
| Data polling | YES |
| Durability | 10000 Write/Erase Cycles |
| JESD-30 code | S-CQCC-J68 |
| JESD-609 code | e0 |
| length | 24.74 mm |
| memory density | 4194304 bit |
| Memory IC Type | EEPROM MODULE |
| memory width | 32 |
| Number of functions | 1 |
| Number of terminals | 68 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX32 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| page size | 128 words |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Programming voltage | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.13 mm |
| Maximum standby current | 0.0012 A |
| Maximum slew rate | 0.24 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| switch bit | YES |
| width | 24.74 mm |
| Maximum write cycle time (tWC) | 10 ms |
| write protect | SOFTWARE |
| PUMA67E4005-15 | PUMA67E4005M-15 | PUMA67E4005M-17 | PUMA67E4005M-20 | PUMA67E4005MB-15 | PUMA67E4005MB-17 | PUMA67E4005MB-20 | |
|---|---|---|---|---|---|---|---|
| Description | EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQCC68, SMD-68 | EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQCC68, SMD-68 | EEPROM Module, 128KX32, 170ns, Parallel, CMOS, CQCC68, SMD-68 | EEPROM Module, 128KX32, 200ns, Parallel, CMOS, CQCC68, SMD-68 | EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQCC68, SMD-68 | EEPROM Module, 128KX32, 170ns, Parallel, CMOS, CQCC68, SMD-68 | EEPROM Module, 128KX32, 200ns, Parallel, CMOS, CQCC68, SMD-68 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc |
| package instruction | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 150 ns | 150 ns | 170 ns | 200 ns | 150 ns | 170 ns | 200 ns |
| Other features | IT ALSO CONFIGURED AS 512K X 8 | IT ALSO CONFIGURED AS 512K X 8 | IT ALSO CONFIGURED AS 512K X 8 | IT ALSO CONFIGURED AS 512K X 8 | IT ALSO CONFIGURED AS 512K X 8 | IT ALSO CONFIGURED AS 512K X 8 | IT ALSO CONFIGURED AS 512K X 8 |
| Spare memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Data polling | YES | YES | YES | YES | YES | YES | YES |
| Durability | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles |
| JESD-30 code | S-CQCC-J68 | S-CQCC-J68 | S-CQCC-J68 | S-CQCC-J68 | S-CQCC-J68 | S-CQCC-J68 | S-CQCC-J68 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 24.74 mm | 24.74 mm | 24.74 mm | 24.74 mm | 24.74 mm | 24.74 mm | 24.74 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE |
| memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| page size | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.13 mm | 5.13 mm | 5.13 mm | 5.13 mm | 5.13 mm | 5.13 mm | 5.13 mm |
| Maximum standby current | 0.0012 A | 0.0012 A | 0.0012 A | 0.0012 A | 0.0012 A | 0.0012 A | 0.0012 A |
| Maximum slew rate | 0.24 mA | 0.24 mA | 0.24 mA | 0.24 mA | 0.24 mA | 0.24 mA | 0.24 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| switch bit | YES | YES | YES | YES | YES | YES | YES |
| width | 24.74 mm | 24.74 mm | 24.74 mm | 24.74 mm | 24.74 mm | 24.74 mm | 24.74 mm |
| Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| write protect | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |